1-14 of 14
Durability
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111312
https://doi.org/10.1115/IPACK2023-111312
View Paper titled, Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
Open the PDF for Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes in another window
Topics: Additive manufacturing, Aerosols, Durability, Electronics, Extruding, Silver
Proceedings Papers

Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Jian Yu, Andres Bujanda, Harvey Tsang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111895
https://doi.org/10.1115/IPACK2023-111895
View Paper titled, Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels
Open the PDF for Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels in another window
Topics: Accelerated life testing, Accelerometers, Additive manufacturing, Aluminum, Circuits, Computer numerical control machine tools, Cracking (Materials), Delamination, Domes (Structural elements), Durability
Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97382
https://doi.org/10.1115/IPACK2022-97382
View Paper titled, Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level
Open the PDF for Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level in another window
Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage
Proceedings Papers

Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73313
https://doi.org/10.1115/IPACK2021-73313
View Paper titled, Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules
Open the PDF for Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules in another window
Topics: Coatings, Coolants, Cooling, Design, Durability, Electric fields, Electronics, Flow (Dynamics), Fluids, Heat
Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
https://doi.org/10.1115/IPACK2019-6408
View Paper titled, Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density
Open the PDF for Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density in another window
Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability
Proceedings Papers

Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation

Abhijit Dasgupta, Ed Habtour, Raman Sridharan, Elaine Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A043, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48709
https://doi.org/10.1115/IPACK2015-48709
View Paper titled, Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation
Open the PDF for Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation in another window
Topics: Durability, Electronic components, Excitation, Testing, Circuits, Printed circuit boards, Degrees of freedom, Dynamics (Mechanics), Vibration, Damage
Proceedings Papers

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Daniel K. Harris, Sushil Bhavnani, Michael C. Hamilton, Wayne Johnson, Roy W. Knight
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A071, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48083
https://doi.org/10.1115/IPACK2015-48083
View Paper titled, Durability of Low Melt Alloys as Thermal Interface Materials
Open the PDF for Durability of Low Melt Alloys as Thermal Interface Materials in another window
Topics: Alloys, Durability, Testing, ASTM International, Copper, Cycles, Gallium, Performance evaluation, Surface finishing, Tin
Proceedings Papers

Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading

Matthew Ernst, Cholmin Choi, Abhijit Dasgupta
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A014, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73200
https://doi.org/10.1115/IPACK2013-73200
View Paper titled, Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading
Open the PDF for Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading in another window
Topics: Time-domain analysis, Transients (Dynamics), Finite element analysis, Cycles, Dynamic analysis, Vibration, Cantilever beams, Circuits, Durability, Manufacturing
Proceedings Papers

Thermo-Mechanical Reliability of Through Silicon Vias (TSVs) and Solder Interconnects in 3-Dimensional Integrated Circuits

Leila J. Ladani, Omar Rodriguez
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 27-32, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89056
https://doi.org/10.1115/InterPACK2009-89056
View Paper titled, Thermo-Mechanical Reliability of Through Silicon Vias (TSVs) and Solder Interconnects in 3-Dimensional Integrated Circuits
Open the PDF for Thermo-Mechanical Reliability of Through Silicon Vias (TSVs) and Solder Interconnects in 3-Dimensional Integrated Circuits in another window
Topics: Integrated circuits, Reliability, Silicon, Solders, Thermomechanics, Design, Durability, Solder joints, Copper, Cycles
Proceedings Papers

Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects

Y. Zhou, M. Al-Bassyiouni, A. Dasgupta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 143-148, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89178
https://doi.org/10.1115/InterPACK2009-89178
View Paper titled, Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects
Open the PDF for Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects in another window
Topics: Accelerometers, Approximation, Bending (Stress), Damage, Durability, Fatigue, Finite element analysis, Manufacturing, Printed circuit boards, Random excitation
Proceedings Papers

SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions

G. Plaza, Y. Zhou, M. Osterman, A. Dasgupta
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 515-521, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33095
https://doi.org/10.1115/IPACK2007-33095
View Paper titled, SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions
Open the PDF for SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions in another window
Topics: Durability, Temperature, Vibration, Solders, Damage, Finite element analysis, High cycle fatigue, Printed circuit boards, Electrical wires, Excitation
Proceedings Papers

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

J. Varghese, A. Dasgupta
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 845-848, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73014
https://doi.org/10.1115/IPACK2005-73014
View Paper titled, Failure Site Transition During Drop Testing of Printed Wiring Assemblies
Open the PDF for Failure Site Transition During Drop Testing of Printed Wiring Assemblies in another window
Topics: Electrical wires, Failure, Testing, Durability, Intermetallic compounds, Solders, Damage, Surface mount packaging, Brittleness, Deformation
Proceedings Papers

Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders

Qian Zhang, Abhijit Dasgupta, Peter Haswell
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 955-960, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35361
https://doi.org/10.1115/IPACK2003-35361
View Paper titled, Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders
Open the PDF for Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders in another window
Topics: Creep, Fatigue, High temperature, Lead-free solders, Solders, Durability, Stress, Temperature, Alloys, Damage
Proceedings Papers

Insertion of HDI and Grid Array Technologies Into Military/Space Applications

Jerry D. Keller
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 783-788, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35248
https://doi.org/10.1115/IPACK2003-35248
View Paper titled, Insertion of HDI and Grid Array Technologies Into Military/Space Applications
Open the PDF for Insertion of HDI and Grid Array Technologies Into Military/Space Applications in another window
Topics: Military systems, Aerospace industry, Density, Electronics, Ball-Grid-Array packaging, Defense industry, Durability, Electronic packaging, Packaging, Printed circuit boards