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Proceedings Papers

Effect of Sintering Conditions on Electrical Resistivity of Printed Silver Inks

Hua Xu, Jeffery C. C. Lo, Xing Qiu, Yuanjie Cheng, Mian Tao, S. W. Ricky Lee, Lawrence C. L. Ko, Ho Ki Yeung, Chun Ho Yau
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111648
https://doi.org/10.1115/IPACK2023-111648
View Paper titled, Effect of Sintering Conditions on Electrical Resistivity of Printed Silver Inks
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Topics: Electrical resistivity, Electronics, Inks, Silver, Sintering
Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
https://doi.org/10.1115/IPACK2022-97457
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74074
https://doi.org/10.1115/IPACK2021-74074
View Paper titled, Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads
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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration
Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6569
https://doi.org/10.1115/IPACK2019-6569
View Paper titled, Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours
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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties
Proceedings Papers

Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages

Pradeep Lall, Yihua Luo, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48639
https://doi.org/10.1115/IPACK2015-48639
View Paper titled, Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
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Topics: Corrosion, Wire, Diffusion (Physics), Electrolytic corrosion, Ions, Copper, Electrical resistivity, Molding, Temperature, Deformation
Proceedings Papers

Thermal Performance Enhancement of Glass Interposer

Sangbeom Cho, Yogendra K. Joshi
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A021, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48563
https://doi.org/10.1115/IPACK2015-48563
View Paper titled, Thermal Performance Enhancement of Glass Interposer
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Topics: Glass, Electronics, Packaging, Brittleness, Computer simulation, Cooling, Copper, Design, Electrical resistivity, Modeling
Proceedings Papers

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Masaru Gotoh, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48197
https://doi.org/10.1115/IPACK2015-48197
View Paper titled, Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity
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Topics: Copper, Thermal conductivity, Thin films, Grain boundaries, Electrical resistivity, Heating, Joules, Stress, Thermal properties, Diffusion (Physics)
Proceedings Papers

Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries

Takahiro Nakanishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48200
https://doi.org/10.1115/IPACK2015-48200
View Paper titled, Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries
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Topics: Grain boundaries, Reliability, Copper, Thin films, Electrical resistivity, Electron backscatter diffraction, Brittleness, Diffusion (Physics), Dislocations, Focused ion beams
Proceedings Papers

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

Michael James Martin, Harish Manohara
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73053
https://doi.org/10.1115/IPACK2013-73053
View Paper titled, Thermo-Electric Modeling of Nanotube-Based Environmental Sensors
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Topics: Modeling, Nanotubes, Sensors, Temperature, Pressure, Bridges (Structures), Heat transfer coefficients, Circuits, Convection, Electrical resistivity
Proceedings Papers

Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73149
https://doi.org/10.1115/IPACK2013-73149
View Paper titled, Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films
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Topics: Reliability, Thin films, Electroplating, Copper, Annealing, Current density, Electrical properties, Electron backscatter diffraction, Electrical resistivity, Grain boundaries
Proceedings Papers

Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnection Embedded in a Si Substrate

Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73148
https://doi.org/10.1115/IPACK2013-73148
View Paper titled, Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnection Embedded in a Si Substrate
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Topics: Copper, Thin films, Electroplating, Electrical properties, Electrical resistivity, Annealing, Bulk solids, Density, Grain boundaries, High temperature
Proceedings Papers

Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 685-690, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52058
https://doi.org/10.1115/IPACK2011-52058
View Paper titled, Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration
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Topics: Copper, Electrodiffusion, Stress, Thin films, Atoms, Sulfur, Current density, Electroplating, Fracture (Materials), Fracture (Process)
Proceedings Papers

Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics

Darin J. Sharar, Brian Morgan, Nicholas R. Jankowski, Avram Bar-Cohen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 133-142, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52079
https://doi.org/10.1115/IPACK2011-52079
View Paper titled, Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics
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Topics: Army, Electronics, Vehicles, Temperature, Energy dissipation, Heat, Coolants, Cooling, Design, Electrical resistivity
Proceedings Papers

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, David A. Brooks, Marc Hodes, Matthew van Lieshout, Vincent P. Manno
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 37-45, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52019
https://doi.org/10.1115/IPACK2011-52019
View Paper titled, Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control
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Topics: Heat, Temperature control, Heat sinks, Temperature, Energy consumption, Algorithms, Thermal resistance, Circuits, Currents, Electrical resistivity
Proceedings Papers

Change of the Electronic Conductivity of Carbon Nanotube and Graphene Sheets Caused by a Three-Dimensional Strain Field

Masato Ohnishi, Yusuke Suzuki, Yusuke Ohashi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 457-462, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52057
https://doi.org/10.1115/IPACK2011-52057
View Paper titled, Change of the Electronic Conductivity of Carbon Nanotube and Graphene Sheets Caused by a Three-Dimensional Strain Field
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Topics: Carbon nanotubes, Electrical conductivity, Graphene, Thermal conductivity, Buckling, Cylinders, Deformation, Shapes, Density functional theory, Electrical resistivity
Proceedings Papers

New Technique for Testing Performance of Thermoelectric Quantum Well Materials

Velimir Jovanovic, Saeid Ghamaty, Norbert B. Elsner, Daniel Krommenhoek, John Morris
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 317-320.8, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89328
https://doi.org/10.1115/InterPACK2009-89328
View Paper titled, New Technique for Testing Performance of Thermoelectric Quantum Well Materials
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Topics: Quantum wells, Testing performance, Electrical resistivity, Thin films, Stress, Temperature, Alloys, Bulk solids, Copper, Electrical properties
Proceedings Papers

Evaluation of Resistance Change as a Predictor of Thermal Actuator Displacement

J. H. Constable, Michael Stevenson, Ming Hung Hung, Bill Infantolino
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 477-484, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89246
https://doi.org/10.1115/InterPACK2009-89246
View Paper titled, Evaluation of Resistance Change as a Predictor of Thermal Actuator Displacement
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Topics: Actuators, Displacement, Electrical resistivity, Microelectromechanical systems, Silicon, Temperature, Dimensions, Electrical resistance, Feedback, Heat conduction
Proceedings Papers

Characterization of the Piezoresistive Coefficients of (100) Silicon From −150 to +125C

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 451-464, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33053
https://doi.org/10.1115/IPACK2007-33053
View Paper titled, Characterization of the Piezoresistive Coefficients of (100) Silicon From −150 to +125C
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Topics: Silicon, Stress, Temperature, Sensors, Anisotropy, Calibration, Chemical etching, Electrical resistivity, Electron mobility, Engineering simulation
Proceedings Papers

Modeling Thermoelectric Device Enhancement of Heat Sink Performance

Richard I. Roser, Robert M. Smythe, Malkiat Singh
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 235-240, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33688
https://doi.org/10.1115/IPACK2007-33688
View Paper titled, Modeling Thermoelectric Device Enhancement of Heat Sink Performance
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Topics: Heat sinks, Modeling, Thermoelectric devices, Temperature, Heat, Cooling, Design, Thermal resistance, Air flow, Dimensions
Proceedings Papers

Chip-on-Beam and Hydrostatic Calibration of the Piezoresistive Coefficients on (111) Silicon

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling, M. Kaysar Rahim
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 297-307, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33570
https://doi.org/10.1115/IPACK2007-33570
View Paper titled, Chip-on-Beam and Hydrostatic Calibration of the Piezoresistive Coefficients on (111) Silicon
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Topics: Calibration, Hydrostatics, Silicon, Stress, Sensors, Temperature, Pressure, Electrical resistivity, Experimental methods, Manufacturing