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Proceedings Papers

Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems

Pardeep Shahi, Ali Heydari, Chandraprakash Hinge, Lochan Sai Reddy Chinthaparthy, Himanshu Modi, Harold Miyamura, Mohammad Tradat, Uschas Chowdhury, Vahideh Radmard, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110576
https://doi.org/10.1115/IPACK2023-110576
View Paper titled, Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems
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Topics: Coolants, Cooling, Data centers, Event history analysis, Reliability
Proceedings Papers

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Sagar Singh, Mostafa Olyaei, Katherine Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111825
https://doi.org/10.1115/IPACK2023-111825
View Paper titled, Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies
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Topics: Batteries, Cooling, Event history analysis, Thermal management
Proceedings Papers

Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments

Pradeep Lall, Hyesoo Jang, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97432
https://doi.org/10.1115/IPACK2022-97432
View Paper titled, Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments
Open the PDF for Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments in another window
Topics: Astronauts, Event history analysis, Manufacturing, Reliability, Sensors
Proceedings Papers

Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Dustin Pense, Hayden Carlton, David Huitink
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6416
https://doi.org/10.1115/IPACK2019-6416
View Paper titled, Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
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Topics: Event history analysis, Thermomechanics, Reliability, Stress, Testing, Thermal conductivity, Adhesion, Adhesives, Cycles, Electronic packages
Proceedings Papers

Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74279
https://doi.org/10.1115/IPACK2017-74279
View Paper titled, Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
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Topics: Event history analysis, Wire, Reliability, Failure, Solders, Copper, Dielectric materials, Manufacturing, Microelectronic devices, Solder joints
Proceedings Papers

Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling

Chaobo Shen, Zhou Hai, Cong Zhao, Jiawei Zhang, M. J. Bozack, J. C. Suhling, John L. Evans
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A033, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48009
https://doi.org/10.1115/IPACK2015-48009
View Paper titled, Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling
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Topics: Event history analysis, Solder joints, Tin, Ball-Grid-Array packaging, Fatigue failure, Finishes, Intermetallic compounds, Solders
Proceedings Papers

Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments

Pradeep Lall, Nakul Kothari, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48457
https://doi.org/10.1115/IPACK2015-48457
View Paper titled, Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments
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Topics: Accelerometers, Event history analysis, Microelectromechanical systems, Modeling, Shock (Mechanics), Failure mechanisms, Capacitance, Failure, Defense industry, Deflection
Proceedings Papers

Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package

Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Takao Mikami, Takaya Kobayashi, Toshiyuki Sato, Toshiaki Enomoto, Koichi Hirata
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 755-759, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89152
https://doi.org/10.1115/InterPACK2009-89152
View Paper titled, Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package
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Topics: Event history analysis, Flip-chip packages, Fatigue life, Finite element analysis, Viscoelasticity, Cooling, Solders, Warping
Proceedings Papers

Circuit Connection Reliability Analysis of Laser-Drilled Blind Via Holes Using Data-Mining Method

Keiji Ogawa, Toshiki Hirogaki, Eiichi Aoyama, Heisaburo Nakagawa
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 603-610, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33077
https://doi.org/10.1115/IPACK2007-33077
View Paper titled, Circuit Connection Reliability Analysis of Laser-Drilled Blind Via Holes Using Data-Mining Method
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Topics: Circuits, Data mining, Event history analysis, Lasers, Thermal stresses, Finite element methods, Reliability, Copper, Plating, Copper foil
Proceedings Papers

Reliability Analysis of Solderless Press-Fit Interconnections

Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 611-615, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33264
https://doi.org/10.1115/IPACK2007-33264
View Paper titled, Reliability Analysis of Solderless Press-Fit Interconnections
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Topics: Event history analysis, Press fits, Manufacturing, Stress, Friction, Printed circuit boards, Damage, Displacement, Failure, Finite element analysis
Proceedings Papers

Failure and Reliability Analysis Influenced by Various Factors Using Accelerated Disturbed State Concept

Russell D. Whitenack, Chandra S. Desai
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 595-604, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35352
https://doi.org/10.1115/IPACK2003-35352
View Paper titled, Failure and Reliability Analysis Influenced by Various Factors Using Accelerated Disturbed State Concept
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Topics: Event history analysis, Failure, Cycles, Approximation, Computers, Design, Electronic packaging, Finite element analysis, Modeling, Reliability
Proceedings Papers

Design and Reliability Analysis of Wafer Level Package With Bubble-Like Buffer Layer

Chang-Chun Lee, Kuo-Ning Chiang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 813-818, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35052
https://doi.org/10.1115/IPACK2003-35052
View Paper titled, Design and Reliability Analysis of Wafer Level Package With Bubble-Like Buffer Layer
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Topics: Bubbles, Design, Event history analysis, Polishing equipment, Reliability, Semiconductor wafers