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Proceedings Papers

AI/ML Applications for Thermally Aware SoC Designs

Adam Norman, Mark Gallina, Olena Zhu, Joyce Weiner, Fabian Garita Gonzalez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97186
https://doi.org/10.1115/IPACK2022-97186
View Paper titled, AI/ML Applications for Thermally Aware SoC Designs
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Topics: Computation, Degrees of freedom, Design, Engineering disciplines, Excitation, Feedback, Machine learning, Modeling, Optimization, Robustness
Proceedings Papers

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Sami Alajlouni, Kerry Maize, Peter Bermel, Ali Shakouri
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6413
https://doi.org/10.1115/IPACK2019-6413
View Paper titled, Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures
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Topics: Aluminum, Electrodiffusion, Imaging, Temperature, Thermoreflectance, Failure, Design, Resolution (Optics), Temperature profiles, Wire
Proceedings Papers

Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation

Abhijit Dasgupta, Ed Habtour, Raman Sridharan, Elaine Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A043, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48709
https://doi.org/10.1115/IPACK2015-48709
View Paper titled, Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation
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Topics: Durability, Electronic components, Excitation, Testing, Circuits, Printed circuit boards, Degrees of freedom, Dynamics (Mechanics), Vibration, Damage
Proceedings Papers

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

Jiaqi Wang, Jeffery C. C. Lo, S. W. Ricky Lee, Feng Yun, Mian Tao
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A046, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48664
https://doi.org/10.1115/IPACK2015-48664
View Paper titled, Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode
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Topics: Absorption, Emissions, Light scattering, Light-emitting diodes, Modeling, Phosphors, Wavelength, Excitation, Emission spectra, Plates (structures)
Proceedings Papers

Diagnostic Technique for Quantitative Resolution of Three-Dimensional Liquid-Gas Phase Boundaries in Microchannel Flows

Ravi S. Patel, Suresh V. Garimella
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73057
https://doi.org/10.1115/IPACK2013-73057
View Paper titled, Diagnostic Technique for Quantitative Resolution of Three-Dimensional Liquid-Gas Phase Boundaries in Microchannel Flows
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Topics: Microchannel flow, Resolution (Optics), Particulate matter, Flow (Dynamics), Transparency, Emissions, Excitation, Fluids, Geometry, Imaging
Proceedings Papers

Characterization of a Macrofiber Piezoelectric Composite

David A. Miller
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 437-441, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52293
https://doi.org/10.1115/IPACK2011-52293
View Paper titled, Characterization of a Macrofiber Piezoelectric Composite
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Displacement measurement, Electrical measurement, Excitation, Fibers, Laminates, Resonance, Service life (Equipment)
Proceedings Papers

Analysing Transient Thermoreflectance Data Using Network Identification by Deconvolution

Y. Ezzahri, A. Shakouri
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 453-462, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89200
https://doi.org/10.1115/InterPACK2009-89200
View Paper titled, Analysing Transient Thermoreflectance Data Using Network Identification by Deconvolution
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Topics: Thermoreflectance, Transients (Dynamics), Excitation, Heat, Heating, Lasers, Systems analysis, Heat conduction, Heat flux, Probes
Proceedings Papers

Direct Measurement of Gyroscope Quadrature Error Using Interferometric Tools

Ryan T. Marinis, Ryszard J. Pryputniewicz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 471-476, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89222
https://doi.org/10.1115/InterPACK2009-89222
View Paper titled, Direct Measurement of Gyroscope Quadrature Error Using Interferometric Tools
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Topics: Errors, Rotation, Interferometry, Coriolis force, Excitation, Resonance, Sensors, Shapes
Proceedings Papers

Study of Printed Circuit Board Shock Transmissibility

Frank Fan Wang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 151-155, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33074
https://doi.org/10.1115/IPACK2007-33074
View Paper titled, Study of Printed Circuit Board Shock Transmissibility
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Topics: Printed circuit boards, Shock (Mechanics), Stress, Deflection, Resonance, Electronics, Excitation
Proceedings Papers

A Mathematical Model Predicting Heat Transfer Performance in a Oscillating Heat Pipe

H. B. Ma, B. Borgmeyer, P. Cheng, Y. Zhang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 669-676, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33246
https://doi.org/10.1115/IPACK2007-33246
View Paper titled, A Mathematical Model Predicting Heat Transfer Performance in a Oscillating Heat Pipe
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Topics: Heat pipes, Heat transfer, Evaporation, Temperature, Condensers (steam plant), Vapors, Bubbles, Bulk modulus, Condensation, Excitation
Proceedings Papers

SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions

G. Plaza, Y. Zhou, M. Osterman, A. Dasgupta
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 515-521, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33095
https://doi.org/10.1115/IPACK2007-33095
View Paper titled, SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions
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Topics: Durability, Temperature, Vibration, Solders, Damage, Finite element analysis, High cycle fatigue, Printed circuit boards, Electrical wires, Excitation
Proceedings Papers

Comparing Shock, Random and Sine Vibration Loads of the Electronic Equipment

Frank Fan Wang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1083-1088, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73005
https://doi.org/10.1115/IPACK2005-73005
View Paper titled, Comparing Shock, Random and Sine Vibration Loads of the Electronic Equipment
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Topics: Electronic equipment, Shock (Mechanics), Stress, Vibration, Resonance, Damage, Excitation, Random vibration, Spectral energy distribution, Waves
Proceedings Papers

Planar Waveguide: Utility in Amino Acid Detection

David R. Wulfman, Tracey Baas, Ronald McGlennen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 681-686, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35300
https://doi.org/10.1115/IPACK2003-35300
View Paper titled, Planar Waveguide: Utility in Amino Acid Detection
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Topics: Waveguides, Biomedicine, Design, Fluorescence, Glass, DNA, Engineering prototypes, Excitation, Filters, Instrumentation