1-16 of 16
Experimental design
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Cagatay Ozdemir
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111534
https://doi.org/10.1115/IPACK2023-111534
View Paper titled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics
Open the PDF for Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics in another window
Topics: Ceramics, Copper, Electronics, Plasma spraying, Spraying (Coating processes), Coatings, Sprays, Surface roughness, Electronic packaging, Additive manufacturing
Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97428
https://doi.org/10.1115/IPACK2022-97428
View Paper titled, Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits
Open the PDF for Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits in another window
Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles
Proceedings Papers

Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Ozdemir, Tricia Schwartz
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69270
https://doi.org/10.1115/IPACK2021-69270
View Paper titled, Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics
Open the PDF for Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics in another window
Topics: Aluminum, Copper, Electronics, Sprays, Ceramics, Manufacturing, Additive manufacturing, Bonding, Deformation, Electrical properties
Proceedings Papers

A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

Weicheng Shu, Jiawen Wang, Xinfeng Zhang, Xiaobing Luo
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6325
https://doi.org/10.1115/IPACK2019-6325
View Paper titled, A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort
Open the PDF for A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort in another window
Topics: Cooling, Experimental design
Proceedings Papers

Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

Raphael Mandel, Serguei Dessiatoun, Patrick McCluskey, Michael Ohadi
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48496
https://doi.org/10.1115/IPACK2015-48496
View Paper titled, Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)
Open the PDF for Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS) in another window
Topics: Cooling, Electronics, Fluids, Vapors, Heat flux, Pressure drop, Computational fluid dynamics, Engineering simulation, Experimental design, Heat transfer
Proceedings Papers

Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Rohan Kulkarni, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 277-282, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89233
https://doi.org/10.1115/InterPACK2009-89233
View Paper titled, Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment
Open the PDF for Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment in another window
Topics: Electronics, Manufacturing, Optical fiber, Polarization (Light), Fibers, Displacement, Polarization (Electricity), Polarization (Waves), Electric discharge, Experimental design
Proceedings Papers

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

Khalid Alzoubi, Susan Lu, Bahgat Sammakia, Mark Poliks
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 27-32, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89247
https://doi.org/10.1115/InterPACK2009-89247
View Paper titled, Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications
Open the PDF for Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications in another window
Topics: Flexible electronics, High cycle fatigue, Metals, Thin films, Unsaturated polyesters, Fracture (Materials), Bulk solids, Electrical resistance, Electronic systems, Failure
Proceedings Papers

Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages

Salil Pradhan, Francois Billaut, Sunil Gopakumar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 321-328, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89405
https://doi.org/10.1115/InterPACK2009-89405
View Paper titled, Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages
Open the PDF for Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages in another window
Topics: Manufacturing, Reliability, Lumber, Pins (Engineering), Ball-Grid-Array packaging, Construction, Cross section (Physics), Design, Experimental design, Failure analysis
Proceedings Papers

Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Rohan Kulkarni, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 261-265, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89221
https://doi.org/10.1115/InterPACK2009-89221
View Paper titled, Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment
Open the PDF for Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment in another window
Topics: Electronics, Manufacturing, Optical fiber, Polarization (Electricity), Polarization (Light), Polarization (Waves), Fibers, Engineering design processes, Experimental design, Manufacturing technology
Proceedings Papers

Challenges and Advances of Heat Pipes in Cooling Notebook Systems

Sridhar V. Machiroutu, Himanshu Pokharna, Masahiro Kuroda
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 677-687, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33249
https://doi.org/10.1115/IPACK2007-33249
View Paper titled, Challenges and Advances of Heat Pipes in Cooling Notebook Systems
Open the PDF for Challenges and Advances of Heat Pipes in Cooling Notebook Systems in another window
Topics: Cooling, Heat pipes, Laptop computers, Design, Computers, Condensers (steam plant), Experimental design, Heat, Heat exchangers, Manufacturing
Proceedings Papers

Development of New Power MOSFETs Package With Double-Sided Cooling

Kisho Ashida, Akira Muto, Ichio Shimizu, Kenya Kawano, Naotaka Tanaka, Nae Yoneda
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 423-427, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33023
https://doi.org/10.1115/IPACK2007-33023
View Paper titled, Development of New Power MOSFETs Package With Double-Sided Cooling
Open the PDF for Development of New Power MOSFETs Package With Double-Sided Cooling in another window
Topics: Cooling, Solders, Fracture (Materials), Thermal resistance, Copper, Fatigue, Fatigue life, Packaging, Structural optimization, Crack propagation
Proceedings Papers

DOE Analysis of Effects of Geometry and Materials on Cu/Low-K Interconnect Stresses

Ming-Che Hsieh, Wei Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 95-99, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33510
https://doi.org/10.1115/IPACK2007-33510
View Paper titled, DOE Analysis of Effects of Geometry and Materials on Cu/Low-K Interconnect Stresses
Open the PDF for DOE Analysis of Effects of Geometry and Materials on Cu/Low-K Interconnect Stresses in another window
Topics: Geometry, Stress, Copper, Finite element analysis, Dimensions, Dielectric materials, Response surface methodology, Design, Design methodology, Experimental design
Proceedings Papers

Fixed Vane Stator Development for Axial Fan Performance Improvement in Electronics Cooling

Gavin D. Stanley
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 555-564, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33306
https://doi.org/10.1115/IPACK2007-33306
View Paper titled, Fixed Vane Stator Development for Axial Fan Performance Improvement in Electronics Cooling
Open the PDF for Fixed Vane Stator Development for Axial Fan Performance Improvement in Electronics Cooling in another window
Topics: Computer cooling, Stators, Computational fluid dynamics, Flow (Dynamics), Pressure, Blades, Fans, Modeling, Experimental design, Acoustics
Proceedings Papers

Thermal Optimal Design for Partially-Confined Compact Heat Sinks

M. P. Wang, H. T. Chen, J. T. Horng, T. Y. Wu, P. L. Chen, Y. H. Hung
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 143-150, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73118
https://doi.org/10.1115/IPACK2005-73118
View Paper titled, Thermal Optimal Design for Partially-Confined Compact Heat Sinks
Open the PDF for Thermal Optimal Design for Partially-Confined Compact Heat Sinks in another window
Topics: Design, Heat sinks, Pressure drop, Thermal resistance, Flow (Dynamics), Composite materials, Experimental design, Forced convection, Heat flux, Optimization
Proceedings Papers

Analysis of an Embedded Sensor in a Composite Laminate for Enabling Damage Detection

Scott Sealing, Charles Seeley, Haleh Ardebili
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 343-348, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35132
https://doi.org/10.1115/IPACK2003-35132
View Paper titled, Analysis of an Embedded Sensor in a Composite Laminate for Enabling Damage Detection
Open the PDF for Analysis of an Embedded Sensor in a Composite Laminate for Enabling Damage Detection in another window
Topics: Composite materials, Damage, Experimental design, Laminates, Sensors
Proceedings Papers

Thermal Analysis of Natural Convection Cooled Switch Mode Power Supplies

Katsuhiro Koizumi, Akito Joboji, Kuniaki Nagahara, Masaru Ishizuka
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 103-109, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35048
https://doi.org/10.1115/IPACK2003-35048
View Paper titled, Thermal Analysis of Natural Convection Cooled Switch Mode Power Supplies
Open the PDF for Thermal Analysis of Natural Convection Cooled Switch Mode Power Supplies in another window
Topics: Natural convection, Switches, Thermal analysis, Power semiconductor devices, Computational methods, Design, Experimental design, Flow simulation, Heat, Modeling