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Proceedings Papers

Key Technologies to Implement High Thermal Ambient Data Center

Shu Zhang, Yu Han, Nishi Ahuja, Xiaohong Liu, Huahua Ren, Guangliang Guo
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A010, July 6–9, 2015
Paper No: IPACK2015-48015
DOI: https://doi.org/10.1115/IPACK2015-48015
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Topics: Data centers, Temperature, Cooling, Design, Internet, Air conditioners, Ceilings, Computers, Energy consumption, Failure
Proceedings Papers

Optimal Fan Speed Control for Thermal Management of Servers

Zhikui Wang, Cullen Bash, Niraj Tolia, Manish Marwah, Xiaoyun Zhu, Parthasarathy Ranganathan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 709-719, July 19–23, 2009
Paper No: InterPACK2009-89074
DOI: https://doi.org/10.1115/InterPACK2009-89074
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Topics: Air flow, Architecture, Control equipment, Cooling, Data centers, Energy consumption, Fans, Feedback, Temperature, Thermal management
Proceedings Papers

Unified Thermal and Power Management in Server Enclosures

Niraj Tolia, Zhikui Wang, Parthasarathy Ranganathan, Cullen Bash, Manish Marwah, Xiaoyun Zhu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 721-730, July 19–23, 2009
Paper No: InterPACK2009-89075
DOI: https://doi.org/10.1115/InterPACK2009-89075
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Topics: Control equipment, Cooling, Data centers, Design, Energy consumption, Energy efficiency, Fans, Feedback, Heat transfer
Proceedings Papers

Desktop NC Machine Tool With Abilities of Compliant Motion and Stick-Slip Motion

Fusaomi Nagata, Shintaro Tani, Takanori Mizobuchi, Tetsuo Hase, Zenku Haga, Keigo Watanabe
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 211-217, July 19–23, 2009
Paper No: InterPACK2009-89042
DOI: https://doi.org/10.1115/InterPACK2009-89042
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Topics: Machine tools, Stick-slip, Finishing, Control systems, Feedback, Feedforward control, Force feedback, Motion control, Lenses (Optics), Mirrors
Proceedings Papers

Evaluation of Resistance Change as a Predictor of Thermal Actuator Displacement

J. H. Constable, Michael Stevenson, Ming Hung Hung, Bill Infantolino
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 477-484, July 19–23, 2009
Paper No: InterPACK2009-89246
DOI: https://doi.org/10.1115/InterPACK2009-89246
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Topics: Actuators, Displacement, Electrical resistivity, Microelectromechanical systems, Silicon, Temperature, Dimensions, Electrical resistance, Feedback, Heat conduction
Proceedings Papers

Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)

Pin-Chuan Chen, Michael W. Mitchell, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 129-135, July 8–12, 2007
Paper No: IPACK2007-33330
DOI: https://doi.org/10.1115/IPACK2007-33330
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Topics: Chain, Flow (Dynamics), Temperature, Temperature distribution, Biomedical microelectromechanical systems, Liquid crystals, Copper, Thermal management, Thermocouples, Thin films
Proceedings Papers

Electro Thermal Modeling of the Micro Flow Sensor With Feedback Control Circuit Using SPICE

Shoji Kamiunten, Hidetomo Nagayo, Masahiro Motosuke, Shinji Honami
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 343-350, July 8–12, 2007
Paper No: IPACK2007-33769
DOI: https://doi.org/10.1115/IPACK2007-33769
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Topics: Circuits, Feedback, Flow sensors, Modeling, Flow (Dynamics), Simulation, Channel flow, Convection, Energy budget (Physics), Fluid dynamics