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Proceedings Papers

Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement

Qianying Wu, Zheng Gong, Chih-Yao Chan, Heungdong Kwon, Kenneth Goodson, Tiwei Wei
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109944
https://doi.org/10.1115/IPACK2023-109944
View Paper titled, Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement
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Topics: Boiling, Bubbles, Computer cooling, Coolants, Cooling, Cooling systems, Drying, Energy consumption, Experimental characterization, Flow (Dynamics)
Proceedings Papers

Variable Area Jet Impingement for High Voltage Power Electronics

Reece Whitt, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111996
https://doi.org/10.1115/IPACK2023-111996
View Paper titled, Variable Area Jet Impingement for High Voltage Power Electronics
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Topics: Electronics, Nozzles, Convection, Coolants, Cooling, Flow (Dynamics), Impingement cooling, Reliability, Temperature, Transients (Dynamics)
Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97434
https://doi.org/10.1115/IPACK2022-97434
View Paper titled, A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
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Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling (TC) Qualification

Min Pei, Milena Vujosevic, Sibasish Mukherjee
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74081
https://doi.org/10.1115/IPACK2017-74081
View Paper titled, Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling (TC) Qualification
Open the PDF for Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling (TC) Qualification in another window
Topics: Temperature, Ball-Grid-Array packaging, Fluctuations (Physics), Accounting, Damage, Engineering standards, Failure, Physics, Reliability, Risk assessment
Proceedings Papers

Unsteady Heat Flux Measurements in Agitated Channel Flows

Smita Agrawal, Terrence Simon, Mark North, Tianhong Cui
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48753
https://doi.org/10.1115/IPACK2015-48753
View Paper titled, Unsteady Heat Flux Measurements in Agitated Channel Flows
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Topics: Channel flow, Heat flux, Flow (Dynamics), Cycles, Heat sinks, Convection, Fluctuations (Physics), Heat exchangers, Heat transfer, Turbulence
Proceedings Papers

Energy Efficiency and Air Quality Considerations in Airside Economized Data Centers

Levente J. Klein, Sergio A. Bermudez, Fernando J. Marianno, Hendrik F. Hamann, Prabjit Singh
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48349
https://doi.org/10.1115/IPACK2015-48349
View Paper titled, Energy Efficiency and Air Quality Considerations in Airside Economized Data Centers
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Topics: Air pollution, Data centers, Energy efficiency, Cooling, Corrosion, Temperature, Sensors, Air conditioning, Air flow, Contamination
Proceedings Papers

Experimental Measurement of Server Thermal Effectiveness for Compact Transient Data Center Models

James W. VanGilder, Zachary M. Pardey, Xuanhang (Simon) Zhang, Christopher Healey
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A012, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73155
https://doi.org/10.1115/IPACK2013-73155
View Paper titled, Experimental Measurement of Server Thermal Effectiveness for Compact Transient Data Center Models
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Topics: Data centers, Transients (Dynamics), Heat, Computational fluid dynamics, Cooling, Fluctuations (Physics), Heat sinks, Specific heat, Temperature
Proceedings Papers

Comparison of Experimental Temperature Results With Numerical Modeling Predictions of a Real-World Compact Data Center Facility

Yasuo Amemiya, Madhusudan Iyengar, Hendrik Hamann, Martin O’Boyle, Michael Schappert, Jing Shen, Theodore van Kessel
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 871-876, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33899
https://doi.org/10.1115/IPACK2007-33899
View Paper titled, Comparison of Experimental Temperature Results With Numerical Modeling Predictions of a Real-World Compact Data Center Facility
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Topics: Computer simulation, Data centers, Temperature, Computational fluid dynamics, Transients (Dynamics), Air conditioning, Temperature profiles, Algorithms, Boundary-value problems, Energy dissipation
Proceedings Papers

Spray Cooling Thermal Management of a Semiconductor Chip Undergoing Probing, Diagnostics, and Failure Analysis

S. Ansari, T. Cader, N. Stoddard, B. Tolman, J. Frank, D. Cotton, T. Wong, N. Pakdaman
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 73-80, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35206
https://doi.org/10.1115/IPACK2003-35206
View Paper titled, Spray Cooling Thermal Management of a Semiconductor Chip Undergoing Probing, Diagnostics, and Failure Analysis
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Topics: Cooling, Failure analysis, Semiconductors (Materials), Sprays, Thermal management, Temperature, Microscopes, Silicon, Coolants, Heat