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Proceedings Papers

Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 7–9, 2019

Paper No: IPACK2019-6539

DOI: https://doi.org/10.1115/IPACK2019-6539

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Topics: Bonding, Cooling, Lasers, Manifolds, Microchannels, Microfabrication, Micromachining, Silicon

Proceedings Papers

Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling

Karen M. Dowling, Ateeq J. Suria, Yoonjin Won, Ashwin Shankar, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson, Debbie G. Senesky

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A006, July 6–9, 2015

Paper No: IPACK2015-48409

DOI: https://doi.org/10.1115/IPACK2015-48409

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Topics: Cooling, Microchannels, Plasma etching, Silicon, Gallium nitride, Electronics, Density, Etching, Finite element analysis, Heat transfer coefficients

Proceedings Papers

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

David H. Altman, Anurag Gupta, Matthew Tyhach

Paper No: IPACK2015-48179

DOI: https://doi.org/10.1115/IPACK2015-48179

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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Junctions, Heat, Integrated circuits, Packaging, Power density, Temperature

Proceedings Papers

Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)

Pin-Chuan Chen, Michael W. Mitchell, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 129-135, July 8–12, 2007

Paper No: IPACK2007-33330

DOI: https://doi.org/10.1115/IPACK2007-33330

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Topics: Chain, Flow (Dynamics), Temperature, Temperature distribution, Biomedical microelectromechanical systems, Liquid crystals, Copper, Thermal management, Thermocouples, Thin films

Proceedings Papers

Thermoelectric Micro-Cooler of Bismuth Telluride Thin Films

Koji Miyazaki, Jun-Ichiro Kurosaki, Masayuki Takashiri, Bertrand Lenoir, Hiroshi Tsukamoto

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 335-342, July 8–12, 2007

Paper No: IPACK2007-33756

DOI: https://doi.org/10.1115/IPACK2007-33756

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Topics: Microcoolers, Thin films, Shades and shadows, Temperature, Thermal conductivity, Annealing, Atmospheric pressure, Bulk solids, Chemical etching, Dry etching

Proceedings Papers

Development of 1D Optical Micro Scanner Driven by Piezoelectric Actuators

Takeshi Kobayashi, Jiunnjye Tsaur, Ryutaro Maeda

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 789-792, July 17–22, 2005

Paper No: IPACK2005-73431

DOI: https://doi.org/10.1115/IPACK2005-73431

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Topics: Piezoelectric actuators, Cantilevers, Hinges, Microelectromechanical systems, Microfabrication, Mirrors, Resonance, Rotation, Silicon-on-insulator

Proceedings Papers

Variable Focal Length Microlens by Low Voltage Electrowetting on Dielectric (EWOD) Actuation

Raj K. Dash, Theodorian Borca-Tasciuc

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 797-802, July 17–22, 2005

Paper No: IPACK2005-73441

DOI: https://doi.org/10.1115/IPACK2005-73441

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Topics: Design, Dielectric liquids, Dielectric materials, Electrodes, Lenses (Optics), Microfabrication

Proceedings Papers

Fabrication of Sub-Micron Silicon Vias by Deep Reactive Ion Etching

Shawn X. D. Zhang, Ronald Hon, S. W. Ricky Lee

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 947-953, July 17–22, 2005

Paper No: IPACK2005-73299

DOI: https://doi.org/10.1115/IPACK2005-73299

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Topics: Manufacturing, Reactive-ion etching, Silicon, Microelectromechanical systems, Microfabrication, Etching, Packaging

Proceedings Papers

Numerical Analysis of Electro-Thermal Phenomena in Metal by Boltzmann Transport Equation for Electron

Kohei Ito, Ryohei Muramoto, Isamu Shiozawa, Yasushi Kakimoto, Takashi Masuoka

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2103-2107, July 17–22, 2005

Paper No: IPACK2005-73199

DOI: https://doi.org/10.1115/IPACK2005-73199

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Topics: Electrons, Metals, Numerical analysis, Equilibrium (Physics), Computer simulation, Heat flux, Microfabrication, Semiconductors (Materials), Thermal conductivity

Proceedings Papers

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Hiren Thacker, Oluwafemi Ogunsola, Muhannad Bakir, James Meindl

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1593-1599, July 17–22, 2005

Paper No: IPACK2005-73302

DOI: https://doi.org/10.1115/IPACK2005-73302

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Topics: Probes, Semiconductor wafers, Testing, Columns (Structural), Microoptoelectromechanical systems, Polymers, Density, Engineering prototypes, Hardware, Microfabrication

Proceedings Papers

Fluid Flow and Thermal Characteristics for a Microchannel Heat Sink Subject to an Impinging Jet

Seok Pil Jang, Sung Jin Kim

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 263-270, July 6–11, 2003

Paper No: IPACK2003-35114

DOI: https://doi.org/10.1115/IPACK2003-35114

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Topics: Fluid dynamics, Heat sinks, Microchannels, Cooling, Pressure drop, Temperature distribution, Flow (Dynamics), Heat transfer, Microfabrication, Sensors

Proceedings Papers

Characterization of Vertical Interconnects in 3-D System in a Package

Qinghua Kang, Altan M. Ferendeci

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 13-18, July 6–11, 2003

Paper No: IPACK2003-35247

DOI: https://doi.org/10.1115/IPACK2003-35247

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Topics: System-in-package, Circuits, Microwaves, Microelectromechanical systems, Dimensions, Junctions, Microfabrication, Millimeter waves, Transmission lines, Wavelength

NARROW

Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal

Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)

Thermoelectric Micro-Cooler of Bismuth Telluride Thin Films

Development of 1D Optical Micro Scanner Driven by Piezoelectric Actuators

Variable Focal Length Microlens by Low Voltage Electrowetting on Dielectric (EWOD) Actuation

Fabrication of Sub-Micron Silicon Vias by Deep Reactive Ion Etching

Numerical Analysis of Electro-Thermal Phenomena in Metal by Boltzmann Transport Equation for Electron

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Fluid Flow and Thermal Characteristics for a Microchannel Heat Sink Subject to an Impinging Jet

Characterization of Vertical Interconnects in 3-D System in a Package

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