1-13 of 13
Multi-chip modules
Close
Sort by
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 105-114, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52297