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Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-94052
https://doi.org/10.1115/IPACK2022-94052
View Paper titled, Additive Manufacturing of Electronic Patterns for Harsh Environments
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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations
Proceedings Papers

Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe

Pawan Singh Kathait, Rajnish N. Sharma
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A023, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74119
https://doi.org/10.1115/IPACK2017-74119
View Paper titled, Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe
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Topics: Heat pipes, Computer cooling, Heat, Oscillations, Vapors, Bubbles, Construction, Design, Flux (Metallurgy), Heat transfer
Proceedings Papers

Unsteady Heat Flux Measurements in Agitated Channel Flows

Smita Agrawal, Terrence Simon, Mark North, Tianhong Cui
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48753
https://doi.org/10.1115/IPACK2015-48753
View Paper titled, Unsteady Heat Flux Measurements in Agitated Channel Flows
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Topics: Channel flow, Heat flux, Flow (Dynamics), Cycles, Heat sinks, Convection, Fluctuations (Physics), Heat exchangers, Heat transfer, Turbulence
Proceedings Papers

Key Technologies to Implement High Thermal Ambient Data Center

Shu Zhang, Yu Han, Nishi Ahuja, Xiaohong Liu, Huahua Ren, Guangliang Guo
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48015
https://doi.org/10.1115/IPACK2015-48015
View Paper titled, Key Technologies to Implement High Thermal Ambient Data Center
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Topics: Data centers, Temperature, Cooling, Design, Internet, Air conditioners, Ceilings, Computers, Energy consumption, Failure
Proceedings Papers

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

Zhenhai Pan, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A023, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48178
https://doi.org/10.1115/IPACK2015-48178
View Paper titled, A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels
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Topics: Boiling, Flow (Dynamics), Microchannels, Modeling, Vapors, Bubbles, Simulation, Currents, Errors, Evaporation
Proceedings Papers

A Numerical Study of Pulsating Heat Pipe Performance

Brian P. d’Entremont, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A025, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48350
https://doi.org/10.1115/IPACK2015-48350
View Paper titled, A Numerical Study of Pulsating Heat Pipe Performance
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Topics: Heat pipes, Slug flows, Boiling, Condensation, Evaporation, Microchannels, Buoyancy, Condensers (steam plant), Flow (Dynamics), Heat transfer
Proceedings Papers

Study on the Flow and Heat Transfer Characteristics of Pulsating Heat Pipe With Asymmetric Configuration

Gi Hwan Kwon, Sung Jin Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A010, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73056
https://doi.org/10.1115/IPACK2013-73056
View Paper titled, Study on the Flow and Heat Transfer Characteristics of Pulsating Heat Pipe With Asymmetric Configuration
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Topics: Flow (Dynamics), Heat pipes, Heat transfer, Fluids, Heat, Oscillations, Condensation, Evaporation, Glass, Visualization
Proceedings Papers

A Flow Visualization Study on the Temperature Oscillations Inside a Loop Heat Pipe With Flat Evaporator

Dongchuan Mo, Guansheng Zou, Shushen Lu, L. Winston Zhang
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A037, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73185
https://doi.org/10.1115/IPACK2013-73185
View Paper titled, A Flow Visualization Study on the Temperature Oscillations Inside a Loop Heat Pipe With Flat Evaporator
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Topics: Flow visualization, Heat pipes, Oscillations, Temperature, Condensers (steam plant), Heating, Vapors, Copper, Flow (Dynamics), Fluids
Proceedings Papers

An Experimental Investigation of Flow Boiling Characteristics in a Single Transparent Heated Microtube

Osamu Kawanami, Shih-Che Huang, Kazunari Kawakami, Itsuro Honda, Yousuke Kawashima, Haruhiko Ohta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 379-387, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89142
https://doi.org/10.1115/InterPACK2009-89142
View Paper titled, An Experimental Investigation of Flow Boiling Characteristics in a Single Transparent Heated Microtube
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Topics: Boiling, Flow (Dynamics), Transparency, Bubbles, Heat flux, Wall temperature, Bubbly flow, Fluids, Gold plating, Heat transfer
Proceedings Papers

Experimental Investigation of Flow Boiling in a Single, Surface-Augmented Silicon Microchannel

Naveenan Thiagarajan, Daniel T. Pate, Sushil H. Bhavnani, Rory J. Jones
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 553-562, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89324
https://doi.org/10.1115/InterPACK2009-89324
View Paper titled, Experimental Investigation of Flow Boiling in a Single, Surface-Augmented Silicon Microchannel
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Topics: Boiling, Flow (Dynamics), Microchannels, Silicon, Subcooling, Cavities, Flux (Metallurgy), Heat sinks, Pressure drop, Cooling
Proceedings Papers

Effects of Acoustic Resonance on Hydrodynamics and Evaporation of a Pendant Liquid Droplet

Jong Hoon Moon, Byung Ha Kang, Ho-Young Kim
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2005-2009, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73111
https://doi.org/10.1115/IPACK2005-73111
View Paper titled, Effects of Acoustic Resonance on Hydrodynamics and Evaporation of a Pendant Liquid Droplet
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Topics: Acoustics, Drops, Evaporation, Hydrodynamics, Oscillations, Resonance, Waves