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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 7–9, 2019
Paper No: IPACK2019-6307
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 29–September 1, 2017
Paper No: IPACK2017-74090
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A047, July 6–9, 2015
Paper No: IPACK2015-48771
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A032, July 16–18, 2013
Paper No: IPACK2013-73153
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 123-131, July 6–8, 2011
Paper No: IPACK2011-52056
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 81-94, July 6–8, 2011
Paper No: IPACK2011-52042
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 753-760, July 19–23, 2009
Paper No: InterPACK2009-89101
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 359-373, July 8–12, 2007
Paper No: IPACK2007-33620
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 985-991, July 8–12, 2007
Paper No: IPACK2007-33069
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 575-585, July 6–11, 2003
Paper No: IPACK2003-35267
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 675-680, July 6–11, 2003
Paper No: IPACK2003-35316