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Proceedings Papers

Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation

Pradeep Lall, Nakul Kothari, John Deep
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, August 29–September 1, 2017
Paper No: IPACK2017-74269
DOI: https://doi.org/10.1115/IPACK2017-74269
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Topics: Damage, Shock (Mechanics), X-rays, Reliability, Deformation, Failure, Imaging, Manufacturing, Nondestructive evaluation, Service life (Equipment)
Proceedings Papers

Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling

Uschas Chowdhury, Manasa Sahini, Ashwin Siddarth, Dereje Agonafer, Steve Branton
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 29–September 1, 2017
Paper No: IPACK2017-74028
DOI: https://doi.org/10.1115/IPACK2017-74028
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Topics: Cooling, Failure, Water, Energy consumption, Fans, Pumps, Data centers, Density, Heat, Redundancy (Engineering)
Proceedings Papers

Discrete Control of Air Conditioning Units in Mission Critical Facilities

Sergio A. Bermudez, Hendrik F. Hamann, Levente J. Klein, Fernando J. Marianno, Alan C. Claassen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A033, July 6–9, 2015
Paper No: IPACK2015-48593
DOI: https://doi.org/10.1115/IPACK2015-48593
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Topics: Air conditioning, Fans, Automatic control, Control systems, Cooling, Data centers, Energy consumption, Failure, Redundancy (Engineering), Safety
Proceedings Papers

A Rack-Level Cooling Redundancy Metric for Data Center Applications

James W. VanGilder, Christopher M. Healey
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 535-539, July 6–8, 2011
Paper No: IPACK2011-52138
DOI: https://doi.org/10.1115/IPACK2011-52138
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Topics: Cooling, Data centers, Redundancy (Engineering), Power systems (Machinery), Cooling systems, Design, System failures, Temperature
Proceedings Papers

Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting

Bicheng Chen, Cemal Basaran
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 647-654, July 19–23, 2009
Paper No: InterPACK2009-89016
DOI: https://doi.org/10.1115/InterPACK2009-89016
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Topics: Interferometry, Nanoscale phenomena, Wavelet transforms, Resolution (Optics), Tensors, Accelerated life testing, Ball-Grid-Array packaging, Computer software, Design, Dynamic testing (Materials)
Proceedings Papers

Optimum Airflow Management for Multi-Board Rack-Mount Equipment

Bhalchandra Puranik, Younes Shabany
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 429-434, July 6–11, 2003
Paper No: IPACK2003-35210
DOI: https://doi.org/10.1115/IPACK2003-35210
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Topics: Air flow, Design, Air filters, Dimensions, Lumber, Noise (Sound), Redundancy (Engineering), Reliability, Telecommunications, Vacuum equipment