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Proceedings Papers

Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020
Paper No: IPACK2020-2550
DOI: https://doi.org/10.1115/IPACK2020-2550
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Topics: Electric motors, Engines, Finite element analysis, Motors, Permanent magnets, Sensitivity analysis, Thermal management
Proceedings Papers

Parametric and Sensitivity Analysis of Power Module Design

L. M. Boteler, M. C. Fish, M. S. Berman
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A029, October 7–9, 2019
Paper No: IPACK2019-6592
DOI: https://doi.org/10.1115/IPACK2019-6592
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Topics: Design, Sensitivity analysis
Proceedings Papers

Design of Passive Two-Phase Thermosyphons for Server Cooling

Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Filippo Cataldo
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 7–9, 2019
Paper No: IPACK2019-6386
DOI: https://doi.org/10.1115/IPACK2019-6386
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Topics: Cooling, Design, Energy consumption, Heat, Cooling systems, Artificial intelligence, Condensers (steam plant), Coolants, Databases, Electric vehicles
Proceedings Papers

Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach

M. Niessner, G. Haubner, W. Hartner, S. Pahlke
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 27–30, 2018
Paper No: IPACK2018-8379
DOI: https://doi.org/10.1115/IPACK2018-8379
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Topics: Design, Radar, Reliability, Solder joints, Simulation, Laminates, Accelerated life testing, Ball-Grid-Array packaging, Materials properties, Mechanical properties
Proceedings Papers

Design Analysis and Performance Evaluation of a Data Center With Indirect Evaporative Cooling

Fatemeh Tavakkoli, Siavash Ebrahimi, Xiaogang Sun, Yan Cui, Ali Heydari
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, August 29–September 1, 2017
Paper No: IPACK2017-74295
DOI: https://doi.org/10.1115/IPACK2017-74295
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Topics: Data centers, Design, Evaporative cooling, Performance evaluation, Cooling, Computational fluid dynamics, Water, Air flow, Air pollution, Cooling systems
Proceedings Papers

Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors

Benjamin Lemke, Rajashree Baskaran, Oliver Paul
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 463-469, July 19–23, 2009
Paper No: InterPACK2009-89171
DOI: https://doi.org/10.1115/InterPACK2009-89171
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Topics: Complementary metal oxide semiconductors, Sensors, Stress, Temperature, Uncertainty, Currents, Sensitivity analysis
Proceedings Papers

Thermal Optimal Design for Heat Sinks or Heat Sink/TEC Assemblies in a Ducted Flow

T. Y. Wu, M. C. Wu, J. T. Horng, S. F. Chang, P. L. Chen, Y. H. Hung
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 213-220, July 8–12, 2007
Paper No: IPACK2007-33285
DOI: https://doi.org/10.1115/IPACK2007-33285
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Topics: Design, Flow (Dynamics), Heat sinks, Quadratic programming, Sensitivity analysis, Thermal resistance, Thermoelectric coolers
Proceedings Papers

Analytical Modeling of Energy Consumption and Thermal Performance of Data Center Cooling Systems: From the Chip to the Environment

Madhusudan Iyengar, Roger R. Schmidt
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 877-886, July 8–12, 2007
Paper No: IPACK2007-33924
DOI: https://doi.org/10.1115/IPACK2007-33924
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Topics: Cooling systems, Data centers, Energy consumption, Modeling, Temperature, Cooling, Air conditioning, Computers, Energy efficiency, Flow (Dynamics)
Proceedings Papers

Thermal Optimal Design for Partially-Confined Compact Heat Sinks

M. P. Wang, H. T. Chen, J. T. Horng, T. Y. Wu, P. L. Chen, Y. H. Hung
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 143-150, July 17–22, 2005
Paper No: IPACK2005-73118
DOI: https://doi.org/10.1115/IPACK2005-73118
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Topics: Design, Heat sinks, Pressure drop, Thermal resistance, Flow (Dynamics), Composite materials, Experimental design, Forced convection, Heat flux, Optimization