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Proceedings Papers

Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

Yangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97349
https://doi.org/10.1115/IPACK2022-97349
View Paper titled, Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Reliability, Thermomechanics, Cycles, Solders, Corners (Structural elements), Bonding, Deformation, Stiffness
Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74278
https://doi.org/10.1115/IPACK2017-74278
View Paper titled, A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation
Proceedings Papers

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Pradeep Lall, Kartik Goyal
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74264
https://doi.org/10.1115/IPACK2017-74264
View Paper titled, Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT
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Topics: Printed circuit boards, Reliability, Solders, X-rays, Deformation, Electronics, Manufacturing, Solder joints, Computerized tomography, Heating
Proceedings Papers

Advancements in Silver Wire Bonding

Subramani Manoharan, Chandradip Patel, Patrick McCluskey
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74286
https://doi.org/10.1115/IPACK2017-74286
View Paper titled, Advancements in Silver Wire Bonding
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Topics: Silver, Wire bonding, Copper, Wire, Reliability, Bonding, Corrosion, Light-emitting diodes, Palladium, Aerospace industry
Proceedings Papers

Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures

Toshihiko Sayama, Hiroyuki Tsuritani, Yoshiyuki Okamoto, Masayoshi Kinoshita, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A025, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48605
https://doi.org/10.1115/IPACK2015-48605
View Paper titled, Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures
Open the PDF for Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures in another window
Topics: Fatigue cracks, Shear (Mechanics), Solder joints, Stiffness, Cycles, Fatigue testing, Fracture (Materials), Stress, Copper, Corners (Structural elements)
Proceedings Papers

A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material

Hirokazu Oriyama, Takashi Kawakami, Takahiro Kinoshita
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48138
https://doi.org/10.1115/IPACK2015-48138
View Paper titled, A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material
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Topics: Creep, Damage, Fatigue, Lead-free solders, Tin, Solder joints, Electronics, Design engineering, Fatigue damage, Stress
Proceedings Papers

FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, John L. Evans, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A039, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48620
https://doi.org/10.1115/IPACK2015-48620
View Paper titled, FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling
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Topics: Finite element analysis, Reliability, Failure, Lead-free solders, Temperature, Accelerated life testing, Ball-Grid-Array packaging, Fracture (Materials), Lumber, Modeling
Proceedings Papers

A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration

Pradeep Lall, Geeta Limaye
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A017, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73245
https://doi.org/10.1115/IPACK2013-73245
View Paper titled, A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration
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Topics: High cycle fatigue, High temperature, Vibration, Temperature, Solders, Stress, Alloys, Electronics, Failure, Failure mechanisms
Proceedings Papers

Development of Highly Reliable BGA and Flip-Chip Structures by Using Cu-Cored Solder Ball

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Shinichi Fujiwara
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 725-732, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52115
https://doi.org/10.1115/IPACK2011-52115
View Paper titled, Development of Highly Reliable BGA and Flip-Chip Structures by Using Cu-Cored Solder Ball
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Topics: Ball-Grid-Array packaging, Flip-chip, Solders, Solder joints, Impact strength, Fatigue life, Finite element analysis, Reliability, Crack propagation, Deformation
Proceedings Papers

A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin

Hiroyuki Sato, Qiang Yu, Ryusuke Sone
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 185-190, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52101
https://doi.org/10.1115/IPACK2011-52101
View Paper titled, A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin
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Topics: Hardening (Curing), Mechanical properties, Resins, Thermal deformation, Aluminum, Warping, Deformation, Elastic moduli, Reliability, Semiconductors (Materials)
Proceedings Papers

Change of the Electronic Conductivity of Carbon Nanotube and Graphene Sheets Caused by a Three-Dimensional Strain Field

Masato Ohnishi, Yusuke Suzuki, Yusuke Ohashi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 457-462, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52057
https://doi.org/10.1115/IPACK2011-52057
View Paper titled, Change of the Electronic Conductivity of Carbon Nanotube and Graphene Sheets Caused by a Three-Dimensional Strain Field
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Topics: Carbon nanotubes, Electrical conductivity, Graphene, Thermal conductivity, Buckling, Cylinders, Deformation, Shapes, Density functional theory, Electrical resistivity
Proceedings Papers

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 19-25, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52063
https://doi.org/10.1115/IPACK2011-52063
View Paper titled, Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps
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Topics: Flip-chip, Flip-chip devices, Mechanical properties, Stress, Copper, Silicon chips, Gages, Packaging, Sensors, Strain gages
Proceedings Papers

Ionic Polymer Metal Composite (IPMC) for MEMS Actuator and Sensor

Hiroki Yanamori, Takuma Kobayashi, Masaki Omiya
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 417-424, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52259
https://doi.org/10.1115/IPACK2011-52259
View Paper titled, Ionic Polymer Metal Composite (IPMC) for MEMS Actuator and Sensor
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Topics: Actuators, Metallic composites, Microelectromechanical systems, Polymers, Sensors, Electrodes, Electric fields, Membranes, Temperature, Composite materials
Proceedings Papers

Effect of Design Parameters on Thermo-Mechanical Stresses in 3D ICS

Leila J. Ladani
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 711-715, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89083
https://doi.org/10.1115/InterPACK2009-89083
View Paper titled, Effect of Design Parameters on Thermo-Mechanical Stresses in 3D ICS
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Topics: Design, Stress, Thermomechanics, Copper, Finite element analysis, Stiffness, Density, Diffusion (Physics), Finite element model, Integrated circuits
Proceedings Papers

Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Takeyuki Itabashi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 797-802, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89232
https://doi.org/10.1115/InterPACK2009-89232
View Paper titled, Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package
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Topics: Ball-Grid-Array packages, Fracture (Materials), Solder joints, Solders, Crack propagation, Shapes, Finite element analysis, Particulate matter, Stiffness, Deformation
Proceedings Papers

Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages

Tetsuya Kugimiya, Kenji Hirohata, Minoru Mukai, Eitaro Miyake, Hiroshi Akiba, Nobutada Ohno, Takashi Kawakami
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 185-190, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89384
https://doi.org/10.1115/InterPACK2009-89384
View Paper titled, Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages
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Topics: Fatigue, Reliability, Solders, Stress analysis (Engineering), Finite element analysis, Deformation, Metals, Molding materials, Absorption, Constitutive equations
Proceedings Papers

Effects of Tooling Tip Wear and Fixture Rigidity on Solder Ball Shear and Ball Pull Tests

Fubin Song, S. W. Ricky Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 889-894, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33933
https://doi.org/10.1115/IPACK2007-33933
View Paper titled, Effects of Tooling Tip Wear and Fixture Rigidity on Solder Ball Shear and Ball Pull Tests
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Topics: Shear (Mechanics), Solders, Stiffness, Tooling, Wear, Failure mechanisms, Fracture (Materials), Gluing, Brittleness, Electromagnetic scattering
Proceedings Papers

Design Optimization of Fixed-Valve Micropumps for Miniature Cooling Systems

Fred K. Forster, Travis Walter
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 137-145, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33829
https://doi.org/10.1115/IPACK2007-33829
View Paper titled, Design Optimization of Fixed-Valve Micropumps for Miniature Cooling Systems
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Topics: Cooling systems, Design, Micropumps, Optimization, Valves, Pumps, Flow (Dynamics), Pressure, Stress, Actuators
Proceedings Papers

Exploring the Possibility of Approximating Viscoelastic Response of Underfill Materials Through the Use of Appropriate Linear-Elastic Material Models

Shankar Ganapathysubramanian, Sandeep Sane, Richard Raymond Dimagiba, Biju I. Chandran
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1523-1528, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73401
https://doi.org/10.1115/IPACK2005-73401
View Paper titled, Exploring the Possibility of Approximating Viscoelastic Response of Underfill Materials Through the Use of Appropriate Linear-Elastic Material Models
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Topics: Approximation, Computer simulation, Elastic analysis, Electronic packaging, Flip-chip, Manufacturing, Modeling, Packaging, Polymers, Risk assessment
Proceedings Papers

The Study of the Design in Micro Modal Actuators Using the Holographic Interferometry

Wei-Hsin Gau, Yuh-Chung Hu, Yen-Yi Peng
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1737-1742, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73333
https://doi.org/10.1115/IPACK2005-73333
View Paper titled, The Study of the Design in Micro Modal Actuators Using the Holographic Interferometry
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Topics: Actuators, Design, Holographic interferometry, Electrodes, Shapes, Stability, Circuits, Electric fields, Equations of motion, Microactuators