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Proceedings Papers

Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique

Pradeep Lall, Md Golam Sarwar, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112061
https://doi.org/10.1115/IPACK2023-112061
View Paper titled, Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique
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Topics: Additive manufacturing, Adhesives, Electronics, Flexible electronics, Printing, Surface mount devices, Sustainability
Proceedings Papers

Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
https://doi.org/10.1115/IPACK2023-114686
View Paper titled, Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform
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Topics: Circuits, Inks, Silver, Water, Printing, Manufacturing, Adhesives, Electronic circuits, Electronics, Filters
Proceedings Papers

Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
https://doi.org/10.1115/IPACK2023-112012
View Paper titled, Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits
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Topics: Bonding, Circuits, Electrical properties, Electronics, Inks, Silver, Water, Adhesives, Low temperature, Solders
Proceedings Papers

Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics

Pradeep Lall, Md Golam Sarwar, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112063
https://doi.org/10.1115/IPACK2023-112063
View Paper titled, Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics
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Topics: Circuits, Electronics, Printing, Silver, Surface mount devices
Proceedings Papers

Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures

Pradeep Lall, Shriram Kulkarni, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111979
https://doi.org/10.1115/IPACK2023-111979
View Paper titled, Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures
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Topics: Adhesives, Anisotropy, Surface mount devices
Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
https://doi.org/10.1115/IPACK2022-97457
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

Karthik Arun Deo, Raymond-Noel Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97253
https://doi.org/10.1115/IPACK2022-97253
View Paper titled, A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints
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Topics: Ball-Grid-Array packaging, Fatigue life, Solder joints, Surface mount devices
Proceedings Papers

PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2614
https://doi.org/10.1115/IPACK2020-2614
View Paper titled, PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
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Topics: Printed circuit boards, Thermomechanics, Stress, Ceramics, Control panels, Deformation, Electronic components, Experimental methods, Finite element analysis, Reliability
Proceedings Papers

Reliability of Interconnections Made of Sintered Silver Nano Particles

Przemyslaw K. Matkowski, Tomasz Falat, Andrzej Moscicki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48795
https://doi.org/10.1115/IPACK2015-48795
View Paper titled, Reliability of Interconnections Made of Sintered Silver Nano Particles
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Topics: Nanoparticles, Reliability, Silver, Sensors, Algorithms, Chain, Coating processes, Coatings, Computerized tomography, Failure mechanisms
Proceedings Papers

Larger Array Fine Pitch Wafer Level Package Drop Test Reliability

Tiao Zhou, Robert Derk, Kaysar Rahim, Xuejun Fan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 693-701, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89018
https://doi.org/10.1115/InterPACK2009-89018
View Paper titled, Larger Array Fine Pitch Wafer Level Package Drop Test Reliability
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Topics: Reliability, Semiconductor wafers, Fracture (Materials), Corners (Structural elements), Failure, Alloys, Failure mechanisms, Finite element analysis, Solder joints, Solders
Proceedings Papers

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73239
https://doi.org/10.1115/IPACK2005-73239
View Paper titled, Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy
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Topics: Alloys, Creep, Heat, Manufacturing, Modeling, Surface mount devices, Bulk solids, Solders, Solder joints, Thermomechanics
Proceedings Papers

A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures

Hisashi Tanie, Takeshi Terasaki, Yasuhiro Naka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1229-1235, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73331
https://doi.org/10.1115/IPACK2005-73331
View Paper titled, A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures
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Topics: Fatigue life, Semiconductors (Materials), Solders, Crack propagation, Fracture (Materials), Ball-Grid-Array packaging, Solder joints, Surface mount devices, Diluents, Damage
Proceedings Papers

BGA Reliability in Automotive Underhood Applications

Pradeep Lall, Nokibul Islam, Jeffrey Suhling, Robert Darveaux
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 823-830, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35243
https://doi.org/10.1115/IPACK2003-35243
View Paper titled, BGA Reliability in Automotive Underhood Applications
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Topics: Ball-Grid-Array packaging, Reliability, Crack propagation, Damage, High temperature, Surface mount devices, Temperature, Errors, Fatigue, Glass transition