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Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021

Paper No: IPACK2021-74044

DOI: https://doi.org/10.1115/IPACK2021-74044

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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature

Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020

Paper No: IPACK2020-2581

DOI: https://doi.org/10.1115/IPACK2020-2581

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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles

Proceedings Papers

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Sami Alajlouni, Kerry Maize, Peter Bermel, Ali Shakouri

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 7–9, 2019

Paper No: IPACK2019-6413

DOI: https://doi.org/10.1115/IPACK2019-6413

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Topics: Aluminum, Electrodiffusion, Imaging, Temperature, Thermoreflectance, Failure, Design, Resolution (Optics), Temperature profiles, Wire

Proceedings Papers

Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters

Bakhtiyar Mohammad Nafis, Ange Iradukunda, David Huitink

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, August 27–30, 2018

Paper No: IPACK2018-8280

DOI: https://doi.org/10.1115/IPACK2018-8280

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Topics: Design, Electric vehicles, Reliability, Traction, Temperature, Cooling, Roads, Temperature profiles, Batteries, Electric motors

Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018

Paper No: IPACK2018-8338

DOI: https://doi.org/10.1115/IPACK2018-8338

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Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products

Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018

Paper No: IPACK2018-8456

DOI: https://doi.org/10.1115/IPACK2018-8456

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Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux

Proceedings Papers

Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading

David Gonzalez-Nino, Lauren M. Boteler, Nicholas R. Jankowski, Dimeji Ibitayo, Pedro O. Quintero

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 29–September 1, 2017

Paper No: IPACK2017-74118

DOI: https://doi.org/10.1115/IPACK2017-74118

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Topics: Phase change materials, Heat, Silicon nitride ceramics, Temperature, Cooling, Cooling systems, Cycles, Inspection, Optical quality control, Temperature profiles

Proceedings Papers

Physics Based Requirements for Qualification of BGA Components in Temperature Cycling

Ru Han, Milena Vujosevic, Min Pei

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A038, July 6–9, 2015

Paper No: IPACK2015-48578

DOI: https://doi.org/10.1115/IPACK2015-48578

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Topics: Ball-Grid-Array packaging, Physics, Temperature, Adhesives, Package on package, Deformation, Reliability, Solder joints, Computer simulation, Damage

Proceedings Papers

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

Masood Razavi, Yuri S. Muzychka, Serpil Kocabiyik

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A050, July 6–9, 2015

Paper No: IPACK2015-48051

DOI: https://doi.org/10.1115/IPACK2015-48051

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Topics: Temperature, Boundary-value problems, Finite element methods, Computer software, Cooling, Flux (Metallurgy), Fourier series, Heat, Heat flux, Laplace equations

Proceedings Papers

Numerical and Experimental Investigation of Shell-and-Tube Phase Change Material Thermal Storage Unit

Thomas H. Sherer, II, Yogendra Joshi

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A051, July 6–9, 2015

Paper No: IPACK2015-48061

DOI: https://doi.org/10.1115/IPACK2015-48061

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Topics: Phase change materials, Shells, Thermal energy storage, Temperature, Transients (Dynamics), Enthalpy, Flow (Dynamics), Fluids, Heat transfer, Paraffin wax

Proceedings Papers

Thermal Modeling of Remote Radio Head Units

Manasa Sahini, Betsegaw Gebrehiwot, Dereje Agonafer, Rocky Colapietro

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A087, July 6–9, 2015

Paper No: IPACK2015-48606

DOI: https://doi.org/10.1115/IPACK2015-48606

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Topics: Modeling, Air flow, Temperature, Computational fluid dynamics, Cooling, Natural convection, Boundary-value problems, Design, Exhaust systems, Heat

Proceedings Papers

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida, Hsin-Hua Tsuei, Timothy J. Chainer

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A027, July 6–9, 2015

Paper No: IPACK2015-48489

DOI: https://doi.org/10.1115/IPACK2015-48489

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Topics: Boiling, Cavities, Coolants, Cooling, Density, Evaporative cooling, Flow (Dynamics), Fluids, Heat transfer, Integrated circuits

Proceedings Papers

A Transient Model for Parallel Flow and Counter Flow Heat Exchangers

K. Abbasi, M. Del Valle, A. P. Wemhoff, A. Ortega

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A008, July 16–18, 2013

Paper No: IPACK2013-73118

DOI: https://doi.org/10.1115/IPACK2013-73118

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Topics: Flow (Dynamics), Heat exchangers, Transients (Dynamics), Fluids, Capacitance, Exterior walls, Finite volume methods, Heat conduction, Heat transfer coefficients, Steady state

Proceedings Papers

Fast Thermal Analysis of Vertically Integrated Circuits (3-D ICs) Using Power Blurring Method

Je-Hyoung Park, Ali Shakouri, Sung-Mo Kang

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 701-707, July 19–23, 2009

Paper No: InterPACK2009-89072

DOI: https://doi.org/10.1115/InterPACK2009-89072

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Topics: Complementary metal oxide semiconductors, Computation, Computer software, Design, Energy dissipation, Errors, Finite element analysis, Heat, Integrated circuits, Optimization

Proceedings Papers

A New Methodology for Cold Plate and Heat Sink Optimization

Jeremy Rice, Monem Alyaser

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 831-840, July 19–23, 2009

Paper No: InterPACK2009-89197

DOI: https://doi.org/10.1115/InterPACK2009-89197

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Topics: Heat sinks, Optimization, Computational fluid dynamics, Anisotropy, Convection, Fins, Fluids, Heat conduction, Heat transfer, Prandtl number

Proceedings Papers

Microscale Temperature Measurements Near the Contact Line of an Evaporating Thin Film in a V-Groove

C. P. Migliaccio, H. K. Dhavaleswarapu, S. V. Garimella

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 363-370, July 19–23, 2009

Paper No: InterPACK2009-89134

DOI: https://doi.org/10.1115/InterPACK2009-89134

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Topics: Evaporation, Microscale devices, Temperature measurement, Thin films, Quartz, Shapes, Geometry, Heat, Heat flux, Heat transfer

Proceedings Papers

Predicting Thermal Stresses Induced by Conjugate Heat Transfer

Mohamed-Nabil Sabry

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 187-191, July 19–23, 2009

Paper No: InterPACK2009-89415

DOI: https://doi.org/10.1115/InterPACK2009-89415

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Topics: Heat transfer, Thermal stresses, Fluids, Design, Heat, Temperature, Temperature profiles, Wall temperature, Boundary-value problems, Degrees of freedom

Proceedings Papers

Effect of Viscoelasticity on Thermalmechanical Stress in Polymers

Yaoyu Pang, Jie-Hua Zhao, Darvin Edwards

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 379-384, July 19–23, 2009

Paper No: InterPACK2009-89169

DOI: https://doi.org/10.1115/InterPACK2009-89169

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Topics: Polymers, Stress, Viscoelasticity, Polymer films, Temperature, Temperature profiles, Thermomechanics

Proceedings Papers

Fast and Accurate Simulation of Heat Transfer in Microarchitectures Using Frequency Domain Techniques

Keivan Etessam-Yazdani, Hendrik F. Hamann, Mehdi Asheghi

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 445-449, July 8–12, 2007

Paper No: IPACK2007-33796

DOI: https://doi.org/10.1115/IPACK2007-33796

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Topics: Heat transfer, Simulation, Computation, Finite element methods, Frequency-domain analysis, Numerical analysis, Temperature profiles

Proceedings Papers

Fluid Flow and Heat Transfer Over a Micro-Sphere

M. A. Antar

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 819-824, July 8–12, 2007

Paper No: IPACK2007-33765

DOI: https://doi.org/10.1115/IPACK2007-33765

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Topics: Fluid dynamics, Heat transfer, Flow (Dynamics), Knudsen number, Cooling, Microscale devices, Reynolds number, Boundary-value problems, Electromechanical devices, Electromechanical systems

NARROW

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading

Physics Based Requirements for Qualification of BGA Components in Temperature Cycling

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

Numerical and Experimental Investigation of Shell-and-Tube Phase Change Material Thermal Storage Unit

Thermal Modeling of Remote Radio Head Units

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

A Transient Model for Parallel Flow and Counter Flow Heat Exchangers

Fast Thermal Analysis of Vertically Integrated Circuits (3-D ICs) Using Power Blurring Method

A New Methodology for Cold Plate and Heat Sink Optimization

Microscale Temperature Measurements Near the Contact Line of an Evaporating Thin Film in a V-Groove

Predicting Thermal Stresses Induced by Conjugate Heat Transfer

Effect of Viscoelasticity on Thermalmechanical Stress in Polymers

Fast and Accurate Simulation of Heat Transfer in Microarchitectures Using Frequency Domain Techniques

Fluid Flow and Heat Transfer Over a Micro-Sphere

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