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Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019
Paper No: IPACK2019-6514
DOI: https://doi.org/10.1115/IPACK2019-6514
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Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Paper No: IPACK2019-6585
DOI: https://doi.org/10.1115/IPACK2019-6585
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A021, August 29–September 1, 2017
Paper No: IPACK2017-74339
DOI: https://doi.org/10.1115/IPACK2017-74339
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Topics: Design, Tiles, Air flow, Computational fluid dynamics, Containment, Cooling, Data centers, Density, Engineering simulation, Flow (Dynamics)
Proceedings Papers

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Jayati D. Athavale, Yogendra Joshi, Minami Yoda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017
Paper No: IPACK2017-74108
DOI: https://doi.org/10.1115/IPACK2017-74108
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Cooling, Temperature, Fans, Pressure, Actuators, Air conditioning
Proceedings Papers

Arcing and Spacing Requirements for High Voltage Printed Circuit Boards

Prabjit Singh
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A011, July 6–9, 2015
Paper No: IPACK2015-48180
DOI: https://doi.org/10.1115/IPACK2015-48180
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Topics: Cellulosic fibers, Circuits, Coating processes, Coatings, Dust, Electric potential, Gates (Closures), Hardware, MOSFET transistors, Physics
Proceedings Papers

Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves

Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Alfonso Ortega, David King, Mark Seymour, Russell Tipton
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A017, July 6–9, 2015
Paper No: IPACK2015-48237
DOI: https://doi.org/10.1115/IPACK2015-48237
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Topics: Cooling, Steady state, Transients (Dynamics), Data centers, Containment, Air flow, Coolers, Failure, Flow (Dynamics), Computational fluid dynamics
Proceedings Papers

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

Kourosh Nemati, Husam A. Alissa, Bruce T. Murray, Bahgat Sammakia, Mark Seymour
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A041, July 6–9, 2015
Paper No: IPACK2015-48244
DOI: https://doi.org/10.1115/IPACK2015-48244
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Topics: Computer simulation, Cooling, Data centers, Heat, Air flow, Energy dissipation, Leakage, Water, Boundary-value problems, Computational fluid dynamics
Proceedings Papers

Development of a Raised-Floor Plenum Design Tool

James W. VanGilder, Xuanhang (Simon) Zhang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A027, July 6–9, 2015
Paper No: IPACK2015-48432
DOI: https://doi.org/10.1115/IPACK2015-48432
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Topics: Design, Air flow, Tiles, Computational fluid dynamics, Cables, Construction, Cooling, Engineering simulation, Flow (Dynamics), Leakage
Proceedings Papers

Creating a Calibrated CFD Model of a Midsize Data Center

Zachary M. Pardey, James W. VanGilder, Christopher M. Healey, David W. Plamondon
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A029, July 6–9, 2015
Paper No: IPACK2015-48448
DOI: https://doi.org/10.1115/IPACK2015-48448
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Topics: Computational fluid dynamics, Data centers, Modeling, Tiles, Air flow, Boundary-value problems, Calibration, Change management, Design, Flow (Dynamics)
Proceedings Papers

The Effectiveness of Data Center Overhead Cooling in Steady and Transient Scenarios: Comparison of Downward Flow to a Cold Aisle Versus Upward Flow From a Hot Aisle

Luis Silva-Llanca, Marcelo del Valle, Alfonso Ortega
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A023, July 6–9, 2015
Paper No: IPACK2015-48423
DOI: https://doi.org/10.1115/IPACK2015-48423
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Topics: Cooling, Data centers, Flow (Dynamics), Transients (Dynamics), Heat exchangers, Cooling systems, Air flow, Energy efficiency, Pressure drop, Temperature
Proceedings Papers

Perforated Tile Airflow Prediction: A Comparison of RANS CFD, Fast Fluid Dynamics, and Potential Flow Modeling

Christopher M. Healey, James W. VanGilder, Zachary M. Pardey
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A024, July 6–9, 2015
Paper No: IPACK2015-48424
DOI: https://doi.org/10.1115/IPACK2015-48424
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Topics: Air flow, Computational fluid dynamics, Flow (Dynamics), Fluid dynamics, Modeling, Reynolds-averaged Navier–Stokes equations, Tiles, Data centers, Buoyancy, Friction
Proceedings Papers

Experimental and Numerical Characterization of a Raised Floor Data Center Using Rapid Operational Flow Curves Model

Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Mark Seymour, Ken Schneebeli, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A016, July 6–9, 2015
Paper No: IPACK2015-48234
DOI: https://doi.org/10.1115/IPACK2015-48234
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Topics: Data centers, Flow (Dynamics), Modeling, Computational fluid dynamics, Pressure, Tiles, Boundary-value problems, Cooling, Dimensions, Ducts
Proceedings Papers

Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center

Sami A. Alkharabsheh, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A019, July 16–18, 2013
Paper No: IPACK2013-73216
DOI: https://doi.org/10.1115/IPACK2013-73216
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Topics: Containment, Data centers, Flow (Dynamics), Leakage, Temperature, Containment systems, Air flow, Approximation, Buoyancy, Computational fluid dynamics
Proceedings Papers

A Numerical Steady State and Dynamic Study in a Data Center Using Calibrated Fan Curves for CRACs and Servers

Sami A. Alkharabsheh, Bahgat Sammakia, Saurabh Shrivastava, Michael Ellsworth, Milnes David, Roger Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A020, July 16–18, 2013
Paper No: IPACK2013-73217
DOI: https://doi.org/10.1115/IPACK2013-73217
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Topics: Data centers, Steady state, Flow (Dynamics), Temperature, Buoyancy, Dynamic models, Energy dissipation, Failure, Air flow, Approximation
Proceedings Papers

Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory

Sami A. Alkharabsheh, Bharathkrishnan Muralidharan, Mahmoud Ibrahim, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A018, July 16–18, 2013
Paper No: IPACK2013-73214
DOI: https://doi.org/10.1115/IPACK2013-73214
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Leakage, Containment, Errors, Calibration, Containment systems, Flow measurement
Proceedings Papers

Evaluation of a Data Center Recirculation Non-Uniformity Metric Using Computational Fluid Dynamics

Dustin W. Demetriou, H. Ezzat Khalifa
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 405-414, July 6–8, 2011
Paper No: IPACK2011-52005
DOI: https://doi.org/10.1115/IPACK2011-52005
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Topics: Computational fluid dynamics, Data centers, Temperature, Buoyancy, Flow (Dynamics), Tiles, Engineering simulation, Simulation, Cooling, Energy consumption
Proceedings Papers

Cold Aisle Air Distribution in a Raised Floor Data Center With Heterogeneous Opposing Orientation Racks

Pramod Kumar, Yogendra Joshi, Michael K. Patterson, Robin Steinbrecher, Marissa Mena
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 497-504, July 6–8, 2011
Paper No: IPACK2011-52117
DOI: https://doi.org/10.1115/IPACK2011-52117
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Topics: Data centers, Air flow, Heat, Stress, Tiles, Air conditioning, Computers, Density, Flow (Dynamics), Particulate matter
Proceedings Papers

Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

Mahmoud Ibrahim, Bahgat Sammakia, Siddharth Bhopte, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 585-593, July 6–8, 2011
Paper No: IPACK2011-52166
DOI: https://doi.org/10.1115/IPACK2011-52166
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Topics: Cooling, Electronic equipment, Temperature, Ceilings, Data centers, Energy dissipation, Heat, Sealing (Process), Air conditioning, Air flow
Proceedings Papers

The Effect of Under-Floor Obstructions on Data Center Perforated Tile Airflow

James W. VanGilder, Zachary R. Sheffer, Xuanhang Simon Zhang, Collyn T. O’Kane
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 505-510, July 6–8, 2011
Paper No: IPACK2011-52127
DOI: https://doi.org/10.1115/IPACK2011-52127
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Topics: Air flow, Data centers, Tiles, Cooling, Architecture, Computational fluid dynamics, Design, Flow (Dynamics), Leakage, Modeling
Proceedings Papers

A Data Center Environmental Advisory System

Christopher Hoover, Niru Kumari, Carlos Felix, Cullen Bash
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 511-517, July 6–8, 2011
Paper No: IPACK2011-52128
DOI: https://doi.org/10.1115/IPACK2011-52128
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Topics: Data centers, Cooling, Air conditioners, Computers, Geometry, Stress, Temperature, Tiles, Vents