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Proceedings Papers

Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate

Anwarul Karim, Tae Kyoung Kim, Daniel Shoemaker, Yiwen Song, Joon Seop Kwak, Sukwon Choi
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-98800
https://doi.org/10.1115/IPACK2022-98800
View Paper titled, Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate
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Topics: Gallium nitride, Gates (Closures), Heating, Reliability, Temperature, Transparency
Proceedings Papers

Transient Performance and Melt Front Characterization of Phase Change Materials

Tyler Stamps, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73252
https://doi.org/10.1115/IPACK2021-73252
View Paper titled, Transient Performance and Melt Front Characterization of Phase Change Materials
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Topics: Phase change materials, Transients (Dynamics), Matlab, Temperature, Computation, Computer simulation, Convection, Finite element analysis, Heat, Heat flux
Proceedings Papers

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6391
https://doi.org/10.1115/IPACK2019-6391
View Paper titled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
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Topics: Computational fluid dynamics, Glass, Heat, Heat transfer, Liquid crystals, Solar energy, Solar radiation, Testing, Temperature, Computer software
Proceedings Papers

Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems

Sevket Umut Yuruker, Mehmet Arik, Enes Tamdogan, Rustamjon Melikov, Sedat Nizamoglu, Daniel Aaron Press, Ilkem Durak
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48326
https://doi.org/10.1115/IPACK2015-48326
View Paper titled, Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems
Open the PDF for Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems in another window
Topics: Cavities, Proteins, Silicones, Biomaterials, Computational fluid dynamics, Light-emitting diodes, Phosphors, Polymers, Thermal conductivity, Absorption
Proceedings Papers

Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites

Hossein Sojoudi, Fernando Reiter, Samuel Graham
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73158
https://doi.org/10.1115/IPACK2013-73158
View Paper titled, Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites
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Topics: Composite materials, Electrodes, Graphene, Single-walled carbon nanotubes, Transparency, Single-walled nanotubes, Chemical vapor deposition, Electrical properties, Annealing, Heat conduction
Proceedings Papers

Diagnostic Technique for Quantitative Resolution of Three-Dimensional Liquid-Gas Phase Boundaries in Microchannel Flows

Ravi S. Patel, Suresh V. Garimella
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73057
https://doi.org/10.1115/IPACK2013-73057
View Paper titled, Diagnostic Technique for Quantitative Resolution of Three-Dimensional Liquid-Gas Phase Boundaries in Microchannel Flows
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Topics: Microchannel flow, Resolution (Optics), Particulate matter, Flow (Dynamics), Transparency, Emissions, Excitation, Fluids, Geometry, Imaging
Proceedings Papers

A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance

Kazuaki Yazawa, Dustin Kendig, James Christofferson, Ali Shakouri
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A023, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73104
https://doi.org/10.1115/IPACK2013-73104
View Paper titled, A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance
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Topics: Electron emission, Failure analysis, Imaging, Thermoreflectance, Circuits, Emissions, Failure, Electrons, Silicon, Temperature
Proceedings Papers

Impedance-Based Void Fraction Measurement and Flow Regime Identification in Microchannel Flows

Sidharth Paranjape, Susan N. Ritchey, Suresh V. Garimella
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 193-202, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52116
https://doi.org/10.1115/IPACK2011-52116
View Paper titled, Impedance-Based Void Fraction Measurement and Flow Regime Identification in Microchannel Flows
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Topics: Flow (Dynamics), Microchannel flow, Porosity, Impedance (Electricity), Two-phase flow, Electrical conductance, Electrical properties, Microchannels, Signals, Transparency
Proceedings Papers

Improvement of Heat Transfer Performance of Loop Heat Pipe for Electronic Devices

Tomonao Takamatsu, Katsumi Hisano, Hideo Iwasaki
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 165-172, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52095
https://doi.org/10.1115/IPACK2011-52095
View Paper titled, Improvement of Heat Transfer Performance of Loop Heat Pipe for Electronic Devices
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Topics: Heat pipes, Heat transfer, Heat, Cooling, Cooling systems, Water, Bubbles, Flow (Dynamics), Stress, Thermal energy
Proceedings Papers

An Experimental Investigation of Flow Boiling Characteristics in a Single Transparent Heated Microtube

Osamu Kawanami, Shih-Che Huang, Kazunari Kawakami, Itsuro Honda, Yousuke Kawashima, Haruhiko Ohta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 379-387, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89142
https://doi.org/10.1115/InterPACK2009-89142
View Paper titled, An Experimental Investigation of Flow Boiling Characteristics in a Single Transparent Heated Microtube
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Topics: Boiling, Flow (Dynamics), Transparency, Bubbles, Heat flux, Wall temperature, Bubbly flow, Fluids, Gold plating, Heat transfer
Proceedings Papers

Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment

Yasushi Nishino, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 341-346, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89103
https://doi.org/10.1115/InterPACK2009-89103
View Paper titled, Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment
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Topics: Cooling, Dimensions, Electronic equipment, Clearances (Engineering), Copper, Flow (Dynamics), Temperature, Ducts, Particulate matter, Transparency
Proceedings Papers

Effects of Localized Heat Generations Due to the Color Conversion in Phosphor Particles and Layers of High Brightness Light Emitting Diodes

Mehmet Arik, Stanton Weaver, Charles Becker, Michael Hsing, Alok Srivastava
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 611-619, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35015
https://doi.org/10.1115/IPACK2003-35015
View Paper titled, Effects of Localized Heat Generations Due to the Color Conversion in Phosphor Particles and Layers of High Brightness Light Emitting Diodes
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Topics: Brightness (Photometry), Heat, Light-emitting diodes, Particulate matter, Phosphors, Reliability, Computer simulation, Finite element analysis, Heating, Light sources
Proceedings Papers

Effect of Package and Board Pad Size on Optimum Flip Chip Ball Grid Array (FCBGA) Package Thermo-Mechanical Performance

Chee Wai Wong, Cheng Siew Tay, Siew Sang Tan, Vasu Vasudevan, Eng Huat Goh, Shaw Fong Wong
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 783-790, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35143
https://doi.org/10.1115/IPACK2003-35143
View Paper titled, Effect of Package and Board Pad Size on Optimum Flip Chip Ball Grid Array (FCBGA) Package Thermo-Mechanical Performance
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Topics: Ball-Grid-Array packaging, Flip-chip, Flip-chip devices, Thermomechanics, Design, Failure, Solder joints, Solder masks, Ball-Grid-Array packages, Modeling