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Proceedings Papers

Modelling Effect of Isothermal Aging of Anisotropic SaAgCu(SAC) Solder Joint Using Crystal Viscoplasticity

Aniket Bharamgonda, Abhijit Dasgupta, Yaxiong Chen, Torsten Hauck
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141036
https://doi.org/10.1115/IPACK2024-141036
View Paper titled, Modelling Effect of Isothermal Aging of Anisotropic SaAgCu(SAC) Solder Joint Using Crystal Viscoplasticity
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Topics: Anisotropy, Creep, Crystals, Modeling, Solder joints, Solders, Viscoplasticity
Proceedings Papers

Effect of Bismuth Concentration on the High Strain Rate Characteristics of Sn-Ag-Cu Solders and Analysis of High-g Level Shock Damage During Extended Sustained Operation at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A024, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141850
https://doi.org/10.1115/IPACK2024-141850
View Paper titled, Effect of Bismuth Concentration on the High Strain Rate Characteristics of Sn-Ag-Cu Solders and Analysis of High-g Level Shock Damage During Extended Sustained Operation at 100°C
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Topics: Damage, Shock (Mechanics), Solders, Temperature, Testing, Tin, Viscoplasticity
Proceedings Papers

Study of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111984
https://doi.org/10.1115/IPACK2023-111984
View Paper titled, Study of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration
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Topics: Finite element analysis, High temperature, Lead-free solders, Reliability, Solders, Temperature, Testing, Vibration, Viscoplasticity
Proceedings Papers

High-G Level Shock Damage-Accrual in Doped/Undoped SnAgCu Solders Under 100°C Sustained Operation Up to 1-Year

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111981
https://doi.org/10.1115/IPACK2023-111981
View Paper titled, High-G Level Shock Damage-Accrual in Doped/Undoped SnAgCu Solders Under 100°C Sustained Operation Up to 1-Year
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Topics: Damage, Shock (Mechanics), Solders, Temperature, Viscoplasticity
Proceedings Papers

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97438
https://doi.org/10.1115/IPACK2022-97438
View Paper titled, High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C
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Topics: Shock (Mechanics), Solders, Temperature, Operating temperature, Alloys, High temperature, Stress, Stress-strain curves, Testing, Aerospace industry
Proceedings Papers

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A020, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74067
https://doi.org/10.1115/IPACK2021-74067
View Paper titled, Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging
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Topics: Alloys, High temperature, Mechanical properties, Shock (Mechanics), Solders, Temperature, Testing, Vibration, Viscoplasticity
Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2660
https://doi.org/10.1115/IPACK2020-2660
View Paper titled, High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging
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Topics: High temperature, Mechanical properties, Testing, Alloys, Operating temperature, Solders, Stress, Aerospace industry, Biomedicine, Electronic components
Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6576
https://doi.org/10.1115/IPACK2019-6576
View Paper titled, High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C
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Topics: Mechanical properties, Storage, Temperature, Alloys, Operating temperature, Electronic components, Electronics, High temperature, Lead-free solders, Shock (Mechanics)
Proceedings Papers

Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging

Laura Spinella, Nick Bosco
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6520
https://doi.org/10.1115/IPACK2019-6520
View Paper titled, Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging
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Topics: Electronic packaging, Fatigue, Packaging, Simulation, Solders, Thermomechanics, Reliability, Climate, Architecture, Electronics
Proceedings Papers

Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8357
https://doi.org/10.1115/IPACK2018-8357
View Paper titled, Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage
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Topics: Constitutive equations, High temperature, Lead-free solders, Mechanical properties, Storage, Solders, Alloys, Drilling, Electronics, Geometry
Proceedings Papers

Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74300
https://doi.org/10.1115/IPACK2017-74300
View Paper titled, Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year
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Topics: Alloys, Storage, High temperature, Solders, Temperature, Deformation, Electronics, Operating temperature, Constitutive equations, Elastic moduli
Proceedings Papers

Reliability Modeling of Lead Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 351-358, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33123
https://doi.org/10.1115/IPACK2007-33123
View Paper titled, Reliability Modeling of Lead Free Solder Joints in Wafer-Level Chip Scale Packages
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Topics: Lead-free solders, Modeling, Reliability, Semiconductor wafers, Fatigue, Constitutive equations, Creep, Errors, Density, Finite element methods
Proceedings Papers

Determination of the Anand Viscoplasticity Model Constants for SnAgCu

Bryan Rodgers, Ben Flood, Jeff Punch, Finbarr Waldron
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1263-1270, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73352
https://doi.org/10.1115/IPACK2005-73352
View Paper titled, Determination of the Anand Viscoplasticity Model Constants for SnAgCu
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Topics: Alloys, ASTM International, Ball-Grid-Array packaging, Bone, Computer software, Constitutive equations, Displacement, Fatigue life, Finite element model, Fittings