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Proceedings Papers

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022
Paper No: IPACK2022-97447
DOI: https://doi.org/10.1115/IPACK2022-97447
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Topics: Cooling, Data centers, Density, Energy consumption, Temperature, Computational fluid dynamics, Design, Flow (Dynamics), Carbon, Cooling systems
Proceedings Papers

Experimental Characterization of the Transient Response of Air/Water Crossflow Heat Exchangers for Data Center Cooling Systems

Marcelo del Valle, Alfonso Ortega
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A021, July 6–9, 2015
Paper No: IPACK2015-48375
DOI: https://doi.org/10.1115/IPACK2015-48375
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Topics: Cooling systems, Data centers, Experimental characterization, Heat exchangers, Transients (Dynamics), Water, Flow (Dynamics), Temperature, Circuits, Cooling
Proceedings Papers

Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling

Mark E. Steinke, Vinod Kamath, Lynn Parnell
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A030, July 6–9, 2015
Paper No: IPACK2015-48466
DOI: https://doi.org/10.1115/IPACK2015-48466
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Topics: Cooling, Water, Design, Air flow, Heat, Energy consumption, Energy efficiency, Stress, Algorithms, Boundary-value problems
Proceedings Papers

Dynamically Controlled Long Duration Operation of a Highly Energy Efficient Chiller-Less Data Center Test Facility

Milnes P. David, Pritish R. Parida, Mark D. Schultz, Robert E. Simons, Michael Gaynes, Roger Schmidt, Timothy J. Chainer
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A014, July 16–18, 2013
Paper No: IPACK2013-73183
DOI: https://doi.org/10.1115/IPACK2013-73183
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Topics: Data centers, Test facilities, Cooling, Energy consumption, Water, Energy efficiency, Computers, Water temperature
Proceedings Papers

Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers

Masataka Mochizuki, Thang Nguyen, Koichi Mashiko, Yuji Saito, Xiao Ping Wu, Tien Nguyen, Vijit Wuttijumnong, Randeep Singh
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 653-661, July 6–8, 2011
Paper No: IPACK2011-52265
DOI: https://doi.org/10.1115/IPACK2011-52265
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Topics: Computers, Data centers, Energy conservation, Heat pipes, Energy storage, Design, Storage, Water storage, Climate change, Control systems
Proceedings Papers

Facility Level Energy and Cost Analyses for Water Cooled Supercomputer Systems

Evan G. Colgan, Madhusudan K. Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 799-806, July 19–23, 2009
Paper No: InterPACK2009-89177
DOI: https://doi.org/10.1115/InterPACK2009-89177
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Topics: Water, Cooling, Design, Heat exchangers, Locations, Server racks, Temperature, Architecture, Computers, Data centers
Proceedings Papers

Thermal Performance of a Mini Liquid-Cooled Cold Plates for Robot Cooling

Sarng Woo Karng, Kyudae Hwang, Jongmin Moon, Seo Young Kim
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1057-1062, July 19–23, 2009
Paper No: InterPACK2009-89410
DOI: https://doi.org/10.1115/InterPACK2009-89410
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Topics: Cooling, Plates (structures), Robots, Aluminum, Copper, Water, Energy dissipation, Flow (Dynamics), Heat, Heat transfer
Proceedings Papers

Heat Transport Characteristics of the Capillary Pumped Loop for Cooling the Tower-Type Computer

Atsushi Tsujimori, Masashi Kato, Hajime Morita, Maiko Uchida
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 27-32, July 17–22, 2005
Paper No: IPACK2005-73023
DOI: https://doi.org/10.1115/IPACK2005-73023
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Topics: Computers, Cooling, Heat, Temperature, Condensers (steam plant), Fluids, Heat flux, Reservoirs, Pressure drop, Refrigerants