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Proceedings Papers

Fabrication of Sub-Micron Silicon Vias by Deep Reactive Ion Etching

Shawn X. D. Zhang, Ronald Hon, S. W. Ricky Lee

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 947-953, July 17–22, 2005

Paper No: IPACK2005-73299

DOI: https://doi.org/10.1115/IPACK2005-73299

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Topics: Manufacturing, Reactive-ion etching, Silicon, Microelectromechanical systems, Microfabrication, Etching, Packaging

Proceedings Papers

Use of Array Capacitors to Improve the Power Delivery Performance of a Microprocessor System

Kimberly D. Eilert, Kaladhar Radhakrishnan, Michael J. Hill, Kemal Aygu¨n

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 955-958, July 17–22, 2005

Paper No: IPACK2005-73301

DOI: https://doi.org/10.1115/IPACK2005-73301

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Topics: Capacitors, Frequency response, Modeling, Optimization, Simulation models

Proceedings Papers

Mechanical Modeling of a Solder Thermal Interface Material: Implications for Thermo-Mechanical Reliability

Sankara J. Subramanian

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 959-963, July 17–22, 2005

Paper No: IPACK2005-73304

DOI: https://doi.org/10.1115/IPACK2005-73304

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Topics: Finite element model, Modeling, Reliability, Solders, Thermomechanics, Cracking (Materials), Fracture (Process), Testing, Brittleness, Corners (Structural elements)

Proceedings Papers

Mechanical Design and Analysis of Land Grid Array (LGA) Sockets

Vinayak Pandey, Sankara Subramanian, Sudarshan Rangaraj, Tod Byquist

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1005-1011, July 17–22, 2005

Paper No: IPACK2005-73360

DOI: https://doi.org/10.1115/IPACK2005-73360

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Topics: Accelerated life testing, Ball-Grid-Array packaging, Computer simulation, Design, Design engineering, Manufacturing, Optimization, Pins (Engineering), Reliability, Shock (Mechanics)

Proceedings Papers

Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

John Lau, S. W. Ricky Lee, Fubin Song, Dongkai Shangguan, Dennis C. Lau, Walter Dauksher

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1013-1019, July 17–22, 2005

Paper No: IPACK2005-73362

DOI: https://doi.org/10.1115/IPACK2005-73362

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Topics: Ball-Grid-Array packaging, Fatigue, Lead-free solders, Alloys, Failure mechanisms, Vehicles

Proceedings Papers

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

John Lau, Ricky Lee, Walter Dauksher, Dongkai Shangguan, Fubin Song, Dennis Lau

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1021-1029, July 17–22, 2005

Paper No: IPACK2005-73364

DOI: https://doi.org/10.1115/IPACK2005-73364

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Topics: Ball-Grid-Array packaging, Fatigue life, Lead-free solders, Reliability, Design, Fatigue, Manufacturing

Proceedings Papers

A Paradigm Shift in the Development of Chemical Mechanical Polishing (CMP): Cost-Effective CMP Planarization in Next Generation Substrate/Package Design and Manufacturing

Stefanie Lotz, Robert Baresel, Dipto Thakurta, Lei Jiang, Tuhin Ghosh

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1031-1036, July 17–22, 2005

Paper No: IPACK2005-73371

DOI: https://doi.org/10.1115/IPACK2005-73371

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Topics: Design, Manufacturing, Polishing, Slurries, Copper, Recycling, Computer-aided design, Data collection, Density, Electroplating

Proceedings Papers

Development of Lead-Free Compatible Molded Underfill (MUF) Materials for Flip Chip Stacked Packaging: Key Challenges and Learnings

Vassou LeBonheur, Choong Kooi Chee

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1037-1044, July 17–22, 2005

Paper No: IPACK2005-73373

DOI: https://doi.org/10.1115/IPACK2005-73373

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Topics: Flip-chip, Packaging

Proceedings Papers

Dual Die Package Design Strategy and Performance

Mahadevan Suryakumar, Lu-Vong T. Phan, Mathew Ma, Wajahat Ahmed

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1045-1051, July 17–22, 2005

Paper No: IPACK2005-73391

DOI: https://doi.org/10.1115/IPACK2005-73391

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Topics: Design, Leakage, Clocks, Cycles, Energy efficiency, Packaging

Proceedings Papers

Characterization of Fine Pitch CSP Solder Joints Under Board-Level Free Fall Drop (BFFD)

Dongji Xie, David Geiger, Dongkai Shangguan, Daniel T. Rooney, Louis J. Gullo

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1053-1062, July 17–22, 2005

Paper No: IPACK2005-73484

DOI: https://doi.org/10.1115/IPACK2005-73484

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Topics: Solder joints, Failure, Finite element analysis, Lumber, Failure analysis, Failure mechanisms, Metals, Probability, Screws, Stress

Proceedings Papers

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

J. Varghese, A. Dasgupta

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 845-848, July 17–22, 2005

Paper No: IPACK2005-73014

DOI: https://doi.org/10.1115/IPACK2005-73014

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Topics: Electrical wires, Failure, Testing, Durability, Intermetallic compounds, Solders, Damage, Surface mount packaging, Brittleness, Deformation

Proceedings Papers

Development of Integrated Process-Ageing Modeling Methodology for Flip Chip on Flex Interconnections With Non-Conductive Adhesives

Xiaowu Zhang, E. H. Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 849-856, July 17–22, 2005

Paper No: IPACK2005-73020

DOI: https://doi.org/10.1115/IPACK2005-73020

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Topics: Adhesives, Flip-chip, Flip-chip devices, Modeling, Stress, Finite element analysis, Finite element model, Reliability, Temperature, Thermomechanics

Proceedings Papers

Solder Joint Reliability Improvement Using the Cold Ball Pull Metrology

George F. Raiser, Dudi Amir

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 857-865, July 17–22, 2005

Paper No: IPACK2005-73045

DOI: https://doi.org/10.1115/IPACK2005-73045

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Topics: Metrology, Nickel, Reliability, Shear (Mechanics), Shock (Mechanics), Solder joints

Proceedings Papers

Simulation of Warpage Considering Both Thermal and Cure Induced Shrinkage During Molding in IC Packaging

Shiang-Yu Teng, Sheng-Jye Hwang

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 867-872, July 17–22, 2005

Paper No: IPACK2005-73062

DOI: https://doi.org/10.1115/IPACK2005-73062

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Topics: Integrated circuit packaging, Molding, Shrinkage (Materials), Simulation, Warping, Pressure, Simulation models, Temperature, Thermal expansion

Proceedings Papers

Novel Cyanide Free Electroless Au Plating for the Reliable Joint Between Ni-P/Au and Sn-Ag-Cu Based Lead Free Solder

Akihiro Aiba, Kazumi Kawamura, Masashi Kumagai

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 873-877, July 17–22, 2005

Paper No: IPACK2005-73079

DOI: https://doi.org/10.1115/IPACK2005-73079

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Topics: Lead-free solders, Plating, Tin, Corrosion, Stability, Ball-Grid-Array packaging, Cyanide process, Displacement, Metals, Oxidation

Proceedings Papers

The Bondabilities of Various Metals Using Ag Metallo-Organic Nanoparticles and These Bonding Mechanisms

Shinji Kobayashi, Eiichi Ide, Shinji Angata, Akio Hirose, Kojiro F. Kobayashi

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 879-885, July 17–22, 2005

Paper No: IPACK2005-73161

DOI: https://doi.org/10.1115/IPACK2005-73161

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Topics: Bonding, Metals, Nanoparticles, Solders

Proceedings Papers

The Sintering Process of Ag Metallo-Organic Nanoparticles and the Influence of the Joining Parameters Upon Cu-to-Cu Joining

Shinji Angata, Eiichi Ide, Akio Hirose, Kojiro F. Kobayashi

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 887-892, July 17–22, 2005

Paper No: IPACK2005-73164

DOI: https://doi.org/10.1115/IPACK2005-73164

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Topics: Joining, Nanoparticles, Sintering, Bonding, Shells, Agglomeration (Materials), Nanotechnology, Pressure, Solders, Surface energy

Proceedings Papers

Effects of Interfacial Microstructure on Strength of Solder Joint Using Sn-Ag-Bi-In Solder

Akio Hirose, Takashi Hojo, Yosuke Sogo, Ryoko Miwa, Kojiro F. Kobayashi, Atsushi Yamaguchi, Akio Furusawa, Kazuto Nishida

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 893-898, July 17–22, 2005

Paper No: IPACK2005-73167

DOI: https://doi.org/10.1115/IPACK2005-73167

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Topics: Ball-Grid-Array packaging, Solder joints, Solders, Tin

Proceedings Papers

Characterization of Thermal Stress Phenomena Induced Into a Packaged Planar Lightwave Circuit Using Fiber Bragg Grating Sensors

Amelia G. Grobnic, Robert James, Ping Lu, Stephen J. Mihailov

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 899-906, July 17–22, 2005

Paper No: IPACK2005-73209

DOI: https://doi.org/10.1115/IPACK2005-73209

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Topics: Circuits, Fiber Bragg gratings, Sensors, Thermal stresses, Photonic equipment, Design, Finite element analysis, Geometry, Optical instruments, Optimization

Proceedings Papers

Structural Analysis of Microelectronic and Photonic Systems

E. Suhir

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 907-920, July 17–22, 2005

Paper No: IPACK2005-73249

DOI: https://doi.org/10.1115/IPACK2005-73249

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Topics: Photonic systems, Structural analysis, Modeling, Design, ASME honors and awards, Engineering disciplines, Engineering research, Experimental methods, Fibers, Finite element analysis

NARROW

Fabrication of Sub-Micron Silicon Vias by Deep Reactive Ion Etching

Use of Array Capacitors to Improve the Power Delivery Performance of a Microprocessor System

Mechanical Modeling of a Solder Thermal Interface Material: Implications for Thermo-Mechanical Reliability

Mechanical Design and Analysis of Land Grid Array (LGA) Sockets

Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

A Paradigm Shift in the Development of Chemical Mechanical Polishing (CMP): Cost-Effective CMP Planarization in Next Generation Substrate/Package Design and Manufacturing

Development of Lead-Free Compatible Molded Underfill (MUF) Materials for Flip Chip Stacked Packaging: Key Challenges and Learnings

Dual Die Package Design Strategy and Performance

Characterization of Fine Pitch CSP Solder Joints Under Board-Level Free Fall Drop (BFFD)

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

Development of Integrated Process-Ageing Modeling Methodology for Flip Chip on Flex Interconnections With Non-Conductive Adhesives

Solder Joint Reliability Improvement Using the Cold Ball Pull Metrology

Simulation of Warpage Considering Both Thermal and Cure Induced Shrinkage During Molding in IC Packaging

Novel Cyanide Free Electroless Au Plating for the Reliable Joint Between Ni-P/Au and Sn-Ag-Cu Based Lead Free Solder

The Bondabilities of Various Metals Using Ag Metallo-Organic Nanoparticles and These Bonding Mechanisms

The Sintering Process of Ag Metallo-Organic Nanoparticles and the Influence of the Joining Parameters Upon Cu-to-Cu Joining

Effects of Interfacial Microstructure on Strength of Solder Joint Using Sn-Ag-Bi-In Solder

Characterization of Thermal Stress Phenomena Induced Into a Packaged Planar Lightwave Circuit Using Fiber Bragg Grating Sensors

Structural Analysis of Microelectronic and Photonic Systems

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