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Keywords: Aspect ratioClose
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 75-82, July 6–8, 2011
Paper No: IPACK2011-52264
... A thermo-mechanical analysis is carried out on a stacked die package having through silicon via technology to study the overall reliability of the package due to varying aspect ratio (size and shape) of through silicon vias, silicon die thickness, underfill thickness and underfill material...
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 9-14, July 19–23, 2009
Paper No: InterPACK2009-89163
... for future IC packaging. However, Cu filling of void free through silicon via with high aspect ratio (AR≥10) has been a challenge for a long time. In this paper, successful fabrication of void free TSV with very high aspect ratio was demonstrated via electroplating process. Proper equipment and processing...