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Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97204
... Abstract In this paper, the thermal performances of a Chiplet module with different numbers of dies were studied. The Chiplet module was assumed to be placed in the same server system, with the same ambient condition, and using the same heat sink. A thermal simulation was conducted to obtain...