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Keywords: PCM
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111964
... to solve this by covering the core PCM material with a protective shell. The resulting particles can be nano to micro sized and allow the PCM to melt without needing a component to contain the liquid phase. These particles are useful for imbedding in other materials to form composites with thermal hot spot...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97399
... Abstract Passive cooling techniques are widely sought-after solutions to thermal management issues in high power electronics due to increased energy dissipation in reduced areas. Phase change materials (PCMs) present a promising secondary passive thermal management opportunity by absorbing...