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Keywords: cold plate
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112084
... cooled spread core configuration server with heat sinks compared to cold plates attached in series in an immersion environment. Cold plates have extremely low thermal resistance compared to standard air cooled heatsinks. Generally, immersion fluids are dielectric, and fluids used in cold plates...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112404
... pushes it to its limits. As a result of the significant rise in IT power densities, single-phase cold plate cooling is becoming increasingly popular. However, the limited availability of a source of chilled water or constrained air distribution routes and the unavailability of raised floors are the main...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111725
...Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2023 October 24-26, 2023, San Diego, California IPACK2023-111725 COMPUTATIONAL ANALYSIS OF THERMAL PERFORMANCE OF WATER-COOLED COLD PLATE...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110587
... advanced cooling technologies, need to be investigated. Liquid cooling is becoming more mainstream to overcome the some of challenges mentioned above. Direct-to-chip cold plate-based liquid cooling is highly efficient and becoming more reliable as the advancement in technology is taking place. Several...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96972
... for a product, and prepare the facility accordingly to align with long term strategy. In this presentation, we will introduce a passive cold plate loop solution (Tide 1.0), based on Meta’s AI training platform (Zion) with eight Open Accelerator Modules (OAM). It reflects the design considerations...
Topics: Cooling
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97476
... in terms of heat transfer and fluid flow characteristics, as well as manufacturability, and reduced weight, material usage, and production cost. topology-based design additive manufacturing heat sink cold plate liquid cooling Proceedings of the ASME 2022 International Technical Conference...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97445
... Abstract Rising power densities at the server level due to increasing performance demands are being met by using efficient thermal management methods such as direct-to-chip liquid cooling. The use of cold plates that are directly installed yields a lower thermal resistance path from the chip...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73954
... and qualification process for developing cost effective LAAC solutions to provide cooling capabilities for multiple socketed packages are also discussed. This effort includes qualifying high performing heat exchanger (finned radiator) and cold plate with different fin designs. Thermal simulations were conducted...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 389-394, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89144
... consumption of this system, liquid cooling system has been developed. This paper reports the development of cold plate technology and vapor chamber application by using micro-channel fin. In case of cold plate application, micro-channel fin technology is good for compact space design, high thermal performance...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 445-450, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73293
...-cooled systems. One method to reduce cost is to use fabricate the cold plate using heatsink manufacturing techniques. Case studies are presented to show liquid-cooling with these lower cost cold plates can provide performance that exceeds air-cooling solutions. Finally, suggestions are offered...
Topics: Cooling