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Keywords: laser drillingClose
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1903-1909, July 17–22, 2005
Paper No: IPACK2005-73474
... energy in the substrate, thermal as well as radiation damage threshold of the substrate and other important laser drilling parameters (e.g., fluence, temporal and spatial characteristics of the beam, residue at the via bottom). 03 04 2009 laser drilling organic packaging modeling...