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Keywords: liquid cooling
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112452
...Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2023 October 24-26, 2023, San Diego, California IPACK2023-112452 EXPERIMENTAL AND NUMERICAL INVESTIGATION OF SINGLE-PHASE LIQUID COOLING...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112404
... grown quickly as a result of evolving technological trends and rising demand for online services, which has also led to an increase in the amount of waste heat generated by IT equipment. Through the implementation of hybrid air and liquid cooling technologies, targeted, on-demand cooling is made...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111959
... been changed. Both air and hybrid (air-liquid) cooling are examined and for the liquid-cooled section, liquid-to-liquid (L2L), and liquid-to-air (L2A) coolant distribution units (CDU) are assessed at two levels of rack and row scale. Total Usage Effectiveness (TUE) and Total Cost of Ownership (TCO...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111307
...Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2023 October 24-26, 2023, San Diego, California IPACK2023-111307 AT SCALE DEVELOPMENT OF THERMAL TEST VEHICLES FOR DATA CENTER LIQUID COOLING...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110587
... LIQUID COOLING DATA CENTERS Pardeep Shahi Nvidia Corporation Santa Clara, CA Ali Heydari Nvidia Corporation Santa Clara, CA Bahareh Eslami Nvidia Corporation Santa Clara, CA Vahideh Radmard Nvidia Corporation Santa Clara, CA Chandraprakash Hinge The University of Texas at Arlington Arlington, TX Himanshu...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97443
... Abstract Direct to chip liquid-cooling technique has been widely implemented for the cooling of processors with high thermal design power. To further enhance the efficiency of liquid cooling, ongoing research focuses on the optimizations at the cold plate level or by changing the flow...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97421
... Abstract Cold plates are at the heart of pumped liquid cooling systems. In this paper, we report on combined experimental, analytical, and computational efforts to characterize and model the thermal performance of advanced cold plates in order to establish their performance limits. A novel...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96972
... Abstract Due to continuous growth of AI accelerator chip power and heat flux, implementation of advanced cooling technologies for AI platforms seems to be inevitable for hyper scale users. Liquid cooling is one of the relatively more mature category of advanced cooling technologies, and has...
Topics: Cooling
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97476
... Abstract This study focuses on a topology-based design approach that can be applied to liquid-cooled heat sinks for high-heat-flux devices with the goal of improving heat dissipation and manufacturability. Specifically, the study investigates the use of additively manufactured topology-based...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97425
... Abstract Increasing demands for cloud-based computing and storage, Internet-of-Things, and machine learning-based applications have necessitated the utilization of more efficient cooling technologies. Direct-to-chip liquid cooling using cold plates has proven to be one of the most efficient...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97445
... Abstract Rising power densities at the server level due to increasing performance demands are being met by using efficient thermal management methods such as direct-to-chip liquid cooling. The use of cold plates that are directly installed yields a lower thermal resistance path from the chip...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97447
.... A gradual transition from 100% air cooling to 25%–75% air and liquid cooling has been studied to capture the changes in IT, fan, facility, and the total data center power consumption. Various system design optimizations such as supply air temperature (SAT), facility chiller water temperature, economization...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97434
... Abstract The rising demand for high-performance central and graphical processing units has resulted in the need for more efficient thermal management techniques like direct-to-chip liquid cooling. Direct Liquid Cooling using cold plates is one of the most efficient and investigated cooling...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73283
... Abstract Impingement split flow liquid-cooled microchannel cold plates are one of several flow configurations used for single-phase liquid cooling. Split flow or top-in/side-exit (TISE) cold plates divide the flow into two branches thus resulting in halved or reduced flow rates and flow lengths...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73031
... removal from LEDs with direct liquid cooling, the current paper starts with explaining the increasing thermal problems in electronics and also in lighting technologies followed by a brief overview of the state of the art for liquid cooling technologies. Then, attention will be turned into thermal...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A053, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73294
... The objective of the study is to improve on performance of the current liquid cooling solution for a Multi-Chip Module (MCM) through design of a chip-scale cold plate with quick and accurate thermal analysis. This can be achieved through application of Flow Network Modeling (FNM...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 389-394, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89144
... consumption of this system, liquid cooling system has been developed. This paper reports the development of cold plate technology and vapor chamber application by using micro-channel fin. In case of cold plate application, micro-channel fin technology is good for compact space design, high thermal performance...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 43-50, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73040
... 03 04 2009 In this paper, quantitative assessments of single-phase liquid cooled heat sinks based on three types of enhancement microstructures are presented for microelectronics applications. The first type is a metallic microchannel heat sink (MMCHS) made of aluminum with the channel...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 259-266, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73189
... quality was 100%. The thermal solution demonstrated good repeatability during a limited cycle test. Contact force of approximately 10 lb f (45 N) was found to minimize the thermal resistance of the solution, and no significant improvement is realized beyond that force level. liquid cooling spray...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 445-450, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73293
... of the limitations of air-cooling for such servers. In this paper, three case studies serve to illustrate the capability of typical air-cooled solutions for low-profile servers. These studies show the inherent limitations of air-cooled solutions for volume-constrained computer systems. Liquid-cooling has been used...
Topics: Cooling