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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97430
... with surface mount components and their response under sustained temperature exposure has been studied. inkjet low pass filter high pass flexible printed electronics Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic...