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Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97175
... related researches mentioned that temperature and time effects on the migration of DEHP, which means the product existed the risk to be contaminated. Therefore, DEHP is phased out from indirectly material to evaluate DEHP-free indirectly material. The manufacture result is shown in this study to evaluate...