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Keywords: nanoparticles
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97399
... an appropriate or effective PCM for the specific application due to deficiencies in a particular material property. Previous studies have demonstrated the ability to alter PCM properties through the homogeneous inclusion of nanoparticles. Thermal conductivity is a particularly important metric for enhancement...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 879-885, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73161
... 03 04 2009 A novel bonding process using Ag metallo-organic nanoparticles has been proposed. This process is applicable to the alternative to the current high temperature solders, such as Pb-10Sn or Pb-20Sn. In this paper, Al, Ti, Ni, Cu, Ag and Au disc joints were made using the Ag...