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Keywords: packages
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Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 241-247, July 8–12, 2007
Paper No: IPACK2007-33707
... 12 01 2010 The conjugate thermal performance of microelectronics module incorporating several power packages and additional passive components in a custom environment is evaluated and further optimized using numerical simulation and experimental validation. The automotive industry...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 113-118, July 17–22, 2005
Paper No: IPACK2005-73100
... The conjugate thermal performance of a microelectronics module incorporating several power packages and additional passive components in a custom environment is evaluated and further optimized using numerical simulation and experimental validation. The automotive industry deals on a daily basis...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 363-370, July 6–11, 2003
Paper No: IPACK2003-35167
... to generate DCTM’s. Three examples are discussed, typical for most package styles: a TQFP (Thin Quad Flat Pack), a BGA (Ball Grid Array) and a power package (SILP). Finally, a method is presented to calibrate detailed models using experimental response curves, thereby eliminating the need for the sometimes...