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Keywords: passive cooling
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111964
... cooling technologies need to be combined to achieve an optimal thermal solution for each package. Passive cooling architectures are beneficial complimentary systems because they can provide thermal gradient mitigation without requiring input power to operate. Phase change materials are one such technology...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111825
... with a preconditioning strategy is benchmarked against passive cooling by a radiator for operating cost, battery lifetime, and net savings. Active cooling can maintain optimal battery temperature but requires an additional 90–200 $/year in electrical costs compared to passive cooling. However, this cost is more than...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97729
... evaporators were cooling the corresponding units. The results show that the thermosyphon can effectively cool both processing units without instabilities. Moreover, the thermosyphon system can operate safely even when one of the two evaporators is not working. electronics cooling passive cooling two...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97399
... Abstract Passive cooling techniques are widely sought-after solutions to thermal management issues in high power electronics due to increased energy dissipation in reduced areas. Phase change materials (PCMs) present a promising secondary passive thermal management opportunity by absorbing...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6385
... Abstract Metallic phase change materials (mPCMs) have been demonstrated as potential passive cooling solution for pulse power applications. The possibility of integrating a metallic PCM directly on top of a heat source, reducing the thermal resistance between the device and the cooling system...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 363-374, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35169
... materials transient power dissipation electronics cooling passive cooling InterPACK 03: cons enha and dime of th therm are v are s supp phas copp chan appl Key mate pass NOM As Bi b Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition July 6-11, 2003, Maui...