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Keywords: pool boiling
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111736
... studies have used micro/nanoengineered surfaces to improve wicking and liquid replenishment mechanism to delay CHF and/or increase the CHF limit. In this work, we investigate the CHF limit of micro-nanotextured oil-impregnated surfaces in pool boiling. Pool boiling experiments in water were conducted...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97266
... remain constant for water at 0 K; however, a remarkable increase was observed for 10 K subcooling from the first to third run of successive measurements. heat transfer pool boiling critical heat flux dielectric liquids surface oxidation Proceedings of the ASME 2022 International Technical...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6307
... by employing structured or 3D microporous coatings to significantly enlarge the interfacial surface area for improved heat transfer rate as well as increase the number of potential sites for bubble nucleation and departure. The bubble dynamics during pool boiling are often considered to be essential...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 575-585, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35267
... Pool boiling from a surface featuring micro-pyramidal re-entrant cavities (mouth size 40 μm) etched in silicon, on a glass substrate, was studied. All experiments were conducted in the dielectric fluid FC-72 at one atmosphere. The heat sink is designed to eliminate spreading through...