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Keywords: power envelopeClose
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97204
... the junction temperatures of dies using different power magnitudes. With the change of power magnitudes of the dies, a thermal resistor matrix was calculated. Finally, with the calculation of the thermal resistor matrix, a unique power envelope plot was developed to determine if the power magnitudes...