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Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 773-779, July 8–12, 2007
Paper No: IPACK2007-33443
... thermal performance prediction methodology based on a superposition method is used to calculate the temperature distribution on a silicon chip due to multiple heat generating logic blocks. Using the superposition method, the predicted temperature distribution in the silicon chip is obtained in a much...