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Keywords: thermal
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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 27–29, 2020
Paper No: IPACK2020-2694
...Abstract Abstract Lead-free solder joints are the most widely used interconnects in electronic packaging industries. Usually solder joints in most of the electronic devices are exposed to an environment where variation of temperature exists, which indicates cyclic thermal loading to be a very...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 27–29, 2020
Paper No: IPACK2020-2606
...Abstract Abstract The increasing demand for high power density wide-bandgap power electronics has propelled heat transfer research leading to a constant increase in the thermal performance of cold plates and heat sinks. Most of this research has focused on reducing thermal resistance...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 921-927, July 19–23, 2009
Paper No: InterPACK2009-89337
... package modules with and without phosphors are evaluated in terms of their thermal resistance and reliability under wet high temperature operation life (WHTOL) test. The WHTOL test is with the condition of 85°C/85% RH and 350mA of forward current for 1008 hrs, specified in JESD22 Method A101-B. First...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 761-767, July 19–23, 2009
Paper No: InterPACK2009-89110
... 07 01 2011 System-level thermal transient analysis of High-Power Dynamic Microelectronics System is performed using numerical simulations. The SmartMOS-type device is packaged in 20 lead SOIC module with exposed copper slug. The package is attached to 4-layer PCB with embedded thermal...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 217-226, July 8–12, 2007
Paper No: IPACK2007-33183
... exchanger and its thermal performance defined. It is found that the air supply temperature from heat exchanger is almost independent of air flow rate and altitude within application range. A thermal model is developed to simulate air temperatures into and out of cell cabinet heat exchanger for evaluating...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 233-239, July 8–12, 2007
Paper No: IPACK2007-33705
... 12 01 2010 A detailed transient thermal study for a Remote Keyless Entry System with dynamic heat sources is performed using numerical simulations. The SmartMOS-type device is packaged in a 54 lead SOIC (small outline IC) package with an exposed copper slug. The package is attached...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 773-779, July 8–12, 2007
Paper No: IPACK2007-33443
... 12 01 2010 A multidisciplinary optimization methodology for placement of heat generating logic blocks on integrated circuit chips is presented. The methodology includes thermal and wiring length criteria, which are optimized simultaneously using the genetic algorithm. An effective...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 863-877, July 6–11, 2003
Paper No: IPACK2003-35296
... will results in many problems including non co-planarity, chip/component surface crack, delamination, poor connectivity, floating, creep, failure and so on. Also PWBAs are sometimes subjected to mechanical loading as well as thermal loading during their lifetime, which will cause PWB deflection and stress...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 461-471, July 6–11, 2003
Paper No: IPACK2003-35225
... constructed and solved analytically. Each axisymmetric segment of the model is a two-port (in thermal terms, a circular fin lacking the traditional adiabatic boundary condition at the outer radius), hence an arbitrarily complex (axisymmetric) board model is represented by a cascaded two-port network...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 111-117, July 6–11, 2003
Paper No: IPACK2003-35055
... application challenges unique to LEDs. Conventional lighting methods provide little guidance for LED thermal problems since these usually involve a very high temperature source, such as a filament or an arc, and radiant heat transfer dissipates the thermal energy. LED junction temperatures are limited to much...