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Keywords: thermal conductivity
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97402
... Abstract Due to increasing computational workload and thermal design power requirements of high power-density microelectronics, low heat carrying capacity and poor thermal conductivity of air renders air-cooling insufficient to meet the cooling demands of component heat generation in high...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97399
... an appropriate or effective PCM for the specific application due to deficiencies in a particular material property. Previous studies have demonstrated the ability to alter PCM properties through the homogeneous inclusion of nanoparticles. Thermal conductivity is a particularly important metric for enhancement...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2662
... is not an efficient method of data center cooling. Hence, the liquid immersion cooling method has emerged as a prominent method, where the server is directly immersed in a dielectric liquid. The thermal conductivity of the dielectric liquids is drastically increased with the introduction of non-metallic nanoparticles...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2207-2215, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73494
... 03 04 2009 This paper presents a Monte Carlo simulation scheme to study the phonon transport and thermal conductivity of nanocomposites. Special attention has been paid to the implementation of periodic boundary condition in Monte Carlo simulation. The scheme is applied to study...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 375-380, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35175
... An insulated metal substrate (IMS) is a circuit board comprising an insulating layer on a metal base plate. The insulating layer is made from epoxy resin incorporating dense inorganic fillers with high thermal conductivity. Because the substrates have high thermal conductivity, they are used...