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Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 363-370, July 6–11, 2003
Paper No: IPACK2003-35167
... The paper presents recent developments in time-dependent (dynamic) compact thermal modeling. Dynamic thermal effects in electronic circuits manifest themselves at all levels from device to system with a serious impact on both reliability and performance especially as the device feature size...