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Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 27–29, 2020
Paper No: IPACK2020-2606
... of the package which can have a detrimental effect on transient thermal performance if thermal capacitance is reduced. In order to provide both a low thermal resistance and a higher thermal capacitance integrated into the package and near the thermal junction, a new cold plate called the Package Integrated...
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A038, July 16–18, 2013
Paper No: IPACK2013-73186
... scenarios. This paper will present the results of recent work on thermoelectric “self cooling” of transient hotspots. A 3-D multi-physics numerical model is used to simulate the spatial and temporal temperature variations associated with a dynamic hotspot on a germanium substrate, for which the hotspot heat...
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 761-767, July 19–23, 2009
Paper No: InterPACK2009-89110
... 07 01 2011 System-level thermal transient analysis of High-Power Dynamic Microelectronics System is performed using numerical simulations. The SmartMOS-type device is packaged in 20 lead SOIC module with exposed copper slug. The package is attached to 4-layer PCB with embedded thermal...
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 233-239, July 8–12, 2007
Paper No: IPACK2007-33705
... 12 01 2010 A detailed transient thermal study for a Remote Keyless Entry System with dynamic heat sources is performed using numerical simulations. The SmartMOS-type device is packaged in a 54 lead SOIC (small outline IC) package with an exposed copper slug. The package is attached...
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 363-370, July 6–11, 2003
Paper No: IPACK2003-35167
... unreliable and time-consuming steady state measurements. compact thermal models dynamic time-dependent transient thermal analysis packages 3URFHHGLQJV RI ,3QWHUQDWLRQDO (OHFWURQLF 3DFNDJLQJ 7HFKQLFDO &RQIHUHQFH DQGKLELWLRQ Proceedings of IPACK03 International Electronic Packaging Technical...