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Keywords: transient
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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 27–29, 2020
Paper No: IPACK2020-2606
... of the package which can have a detrimental effect on transient thermal performance if thermal capacitance is reduced. In order to provide both a low thermal resistance and a higher thermal capacitance integrated into the package and near the thermal junction, a new cold plate called the Package Integrated...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A038, July 16–18, 2013
Paper No: IPACK2013-73186
... scenarios. This paper will present the results of recent work on thermoelectric “self cooling” of transient hotspots. A 3-D multi-physics numerical model is used to simulate the spatial and temporal temperature variations associated with a dynamic hotspot on a germanium substrate, for which the hotspot heat...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 761-767, July 19–23, 2009
Paper No: InterPACK2009-89110
... 07 01 2011 System-level thermal transient analysis of High-Power Dynamic Microelectronics System is performed using numerical simulations. The SmartMOS-type device is packaged in 20 lead SOIC module with exposed copper slug. The package is attached to 4-layer PCB with embedded thermal...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 233-239, July 8–12, 2007
Paper No: IPACK2007-33705
... 12 01 2010 A detailed transient thermal study for a Remote Keyless Entry System with dynamic heat sources is performed using numerical simulations. The SmartMOS-type device is packaged in a 54 lead SOIC (small outline IC) package with an exposed copper slug. The package is attached...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 363-370, July 6–11, 2003
Paper No: IPACK2003-35167
... unreliable and time-consuming steady state measurements. compact thermal models dynamic time-dependent transient thermal analysis packages 3URFHHGLQJV RI ,3QWHUQDWLRQDO (OHFWURQLF 3DFNDJLQJ 7HFKQLFDO &RQIHUHQFH DQGKLELWLRQ Proceedings of IPACK03 International Electronic Packaging Technical...