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Keywords: wiring length
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Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 773-779, July 8–12, 2007
Paper No: IPACK2007-33443
... 12 01 2010 A multidisciplinary optimization methodology for placement of heat generating logic blocks on integrated circuit chips is presented. The methodology includes thermal and wiring length criteria, which are optimized simultaneously using the genetic algorithm. An effective...