Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

Topics: Cooling , Plates (structures) , Thermal resistance , Flow (Dynamics) , Pressure drop , Computational fluid dynamics , Coolants , Cooling systems , Engineering simulation , Fluids

Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, Akshay Lakshminarayana, Harold Miyamura, Gautam Gupta, Dereje Agonafer, Jeremy Rodriguez

InterPACK 2022; V001T01A009https://doi.org/10.1115/IPACK2022-97425

Abstract

View Articletitled, Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment

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Topics: Cooling , Data centers , Flow control , Plates (structures) , Transients (Dynamics)

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer

InterPACK 2022; V001T01A010https://doi.org/10.1115/IPACK2022-97429

Abstract

View Articletitled, Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

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Topics: Building renovation , Computational fluid dynamics , Coolants , Cooling , Data centers , Flow (Dynamics) , Fluids , Geometry , Heat , Heat transfer

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez

InterPACK 2022; V001T01A011https://doi.org/10.1115/IPACK2022-97434

Abstract

View Articletitled, A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

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Topics: Coolants , Cooling , Data centers , Fluctuations (Physics) , Heat , Plates (structures) , Stress , Temperature , Failure , Flow control

Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level

Himanshu Modi, Pardeep Shahi, Akiilessh Sivakumar, Satyam Saini, Pratik Bansode, Vibin Shalom, Amrutha Valli Rachakonda, Gautam Gupta, Dereje Agonafer

InterPACK 2022; V001T01A012https://doi.org/10.1115/IPACK2022-97443

Abstract

View Articletitled, Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level

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Topics: Computational fluid dynamics , Cooling , Transient analysis , Transients (Dynamics)

CFD Analysis of Heat Capture Ratio in a Hybrid Cooled Server

Vibin Shalom Simon, Lochan Sai Reddy, Pardeep Shahi, Amrutha Valli, Satyam Saini, Himanshu Modi, Pratik Bansode, Dereje Agonafer

InterPACK 2022; V001T01A013https://doi.org/10.1115/IPACK2022-97445

Abstract

View Articletitled, CFD Analysis of Heat Capture Ratio in a Hybrid Cooled Server

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Topics: Computational fluid dynamics , Cooling , Heat

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez

InterPACK 2022; V001T01A014https://doi.org/10.1115/IPACK2022-97447

Abstract

View Articletitled, Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

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Topics: Cooling , Data centers , Density , Energy consumption , Temperature , Computational fluid dynamics , Design , Flow (Dynamics) , Carbon , Cooling systems

Data Driven Modeling Advancements for Thermal Predictions in Data Center Applications

Dhaval Patel, Yogendra Joshi

InterPACK 2022; V001T01A015https://doi.org/10.1115/IPACK2022-97478

Abstract

View Articletitled, Data Driven Modeling Advancements for Thermal Predictions in Data Center Applications

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Topics: Data centers , Modeling , Transients (Dynamics)

Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling

Joseph Herring, Peter Smith, Jacob Lamotte-Dawaghreh, Pratik Bansode, Satyam Saini, Rabin Bhandari, Dereje Agonafer

InterPACK 2022; V001T01A016https://doi.org/10.1115/IPACK2022-97481

Abstract

View Articletitled, Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling

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Topics: Artificial neural networks , Computational fluid dynamics , Cooling , Heat sinks , Machine learning , Machinery , Optimization , Thermal management

Single-Phase Immersion Cooling Study of a High-Density Storage System

Saket Karajgikar, Jasper Kidger, Andrew Shaw, Neil Edmunds, Veerendra Mulay

InterPACK 2022; V001T01A017https://doi.org/10.1115/IPACK2022-97490

Abstract

View Articletitled, Single-Phase Immersion Cooling Study of a High-Density Storage System

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Topics: Cooling , Density , Storage

Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer

InterPACK 2022; V001T01A018https://doi.org/10.1115/IPACK2022-97494

Abstract

View Articletitled, Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

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Topics: Cooling , Data centers , Density , Doors , Heat exchangers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer

InterPACK 2022; V001T01A019https://doi.org/10.1115/IPACK2022-97587

Abstract

View Articletitled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

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Topics: Cooling , Design , Air flow , Heat sinks , Temperature , Cloud computing , Energy consumption , Flow (Dynamics) , Graphics processing units , Heat

Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling

Filippo Cataldo, Raffaele Luca Amalfi

InterPACK 2022; V001T01A020https://doi.org/10.1115/IPACK2022-97729

Abstract

View Articletitled, Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling

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Topics: Computer cooling , Cooling , Cooling systems

Power Density in the Context of Two-Phase Immersion Cooling

Jimil M. Shah, Phillip E. Tuma

InterPACK 2022; V001T01A021https://doi.org/10.1115/IPACK2022-96370

Abstract

View Articletitled, Power Density in the Context of Two-Phase Immersion Cooling

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Topics: Cooling , Fluids , Power density

Digital Technologies in Microelectronics

AI/ML Applications for Thermally Aware SoC Designs

Adam Norman, Mark Gallina, Olena Zhu, Joyce Weiner, Fabian Garita Gonzalez

InterPACK 2022; V001T02A001https://doi.org/10.1115/IPACK2022-97186

Abstract

View Articletitled, AI/ML Applications for Thermally Aware SoC Designs

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Topics: Computation , Degrees of freedom , Design , Engineering disciplines , Excitation , Feedback , Machine learning , Modeling , Optimization , Robustness

Flexible and Wearable Electronics

Additive Manufacturing of Electronic Patterns for Harsh Environments

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette

InterPACK 2022; V001T03A001https://doi.org/10.1115/IPACK2022-94052

Abstract

View Articletitled, Additive Manufacturing of Electronic Patterns for Harsh Environments

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Topics: Additive manufacturing , Extruding , Modeling , Strain measurement , Internet of things , Adhesives , Blocks (Building materials) , Inks , Optimization , Oscillations

Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods

David Leslie, Abhijit Dasgupta, Andrei Damian

InterPACK 2022; V001T03A002https://doi.org/10.1115/IPACK2022-97363

Abstract

View Articletitled, Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods

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Topics: Creep , Silver

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang

InterPACK 2022; V001T03A003https://doi.org/10.1115/IPACK2022-97382

Abstract

View Articletitled, Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

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Topics: Durability , Failure , Domes (Structural elements) , Cantilever beams , Disks , Silver , Additive manufacturing , Bending (Stress) , Clamps (Tools) , Damage

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller

InterPACK 2022; V001T03A004https://doi.org/10.1115/IPACK2022-97428

Abstract

View Articletitled, Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

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Topics: Circuits , Drops , Electronics , Equipment performance , Experimental design , Inks , Manufacturing , Materials properties , Mechanical properties , Nanoparticles

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Pradeep Lall, Kartik Goyal, Scott Miller

InterPACK 2022; V001T03A005https://doi.org/10.1115/IPACK2022-97430

Abstract

View Articletitled, Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

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Topics: Circuits , Electronics , Temperature , Surface mount components , Filters , Manufacturing , Printing , Wearable devices , Energy dissipation , Heat

ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging

Pradeep Lall, Hyesoo Jang

InterPACK 2022; V001T03A006https://doi.org/10.1115/IPACK2022-97431

Abstract

View Articletitled, ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging

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Topics: Artificial neural networks , Batteries , Lithium-ion batteries , Machine learning , Reliability , Simulation

Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments

Pradeep Lall, Hyesoo Jang, Curtis Hill

InterPACK 2022; V001T03A007https://doi.org/10.1115/IPACK2022-97432

Abstract

View Articletitled, Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments

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Topics: Astronauts , Event history analysis , Manufacturing , Reliability , Sensors

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller

InterPACK 2022; V001T03A008https://doi.org/10.1115/IPACK2022-97437

Abstract

View Articletitled, Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

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Topics: Artificial neural networks , Geometry , Inks , Printing , Dimensions , Particulate matter , Computer software , Control algorithms , Electronics , Regression models

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

Pradeep Lall, Ved Soni, Scott Miller

InterPACK 2022; V001T03A009https://doi.org/10.1115/IPACK2022-97450

Abstract

View Articletitled, Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

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Topics: Circuits , Electronics , Printing

SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates

Pradeep Lall, Ved Soni

InterPACK 2022; V001T03A010https://doi.org/10.1115/IPACK2022-97451

Abstract

View Articletitled, SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates

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Topics: Batteries , Biomedical equipment , Cycles , Electronics , Errors , Flexible electronics , Industrial research , Model validation , Modeling , Service life (Equipment)

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

InterPACK 2022; V001T03A011https://doi.org/10.1115/IPACK2022-97456

Abstract

View Articletitled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

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Topics: Adhesives , Anisotropy , Circuits , Electrical properties , Failure , Reliability , Temperature , Electronics , Low temperature , Bonding

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill

InterPACK 2022; V001T03A012https://doi.org/10.1115/IPACK2022-97457

Abstract

View Articletitled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

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Topics: Artificial neural networks , Circuits , Copper , Flexible electronics , High temperature , Reliability , Electrical resistivity , Sintering , Adhesives , Electronics

Harsh Environment Electronic Applications for Transportation Systems

Machine Learning Enables Autonomous Vehicles Under Extreme Environmental Conditions

Nhi V. Quach, Jewoo Park, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Alex K. Lee, Chenxi Yin, Yoonjin Won

InterPACK 2022; V001T04A001https://doi.org/10.1115/IPACK2022-96542

Abstract

View Articletitled, Machine Learning Enables Autonomous Vehicles Under Extreme Environmental Conditions

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Topics: Autonomous vehicles , Machine learning

Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures

Pradeep Lall, Aathi Raja Ram Pandurangan, Jaimal Williamson

InterPACK 2022; V001T04A002https://doi.org/10.1115/IPACK2022-97424

Abstract

View Articletitled, Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures

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Topics: Delamination , Fatigue , Fracture toughness , Temperature

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

InterPACK 2022; V001T04A003https://doi.org/10.1115/IPACK2022-97452

Abstract

View Articletitled, Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

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Topics: Alloys , Shock (Mechanics) , Solders , Vibration , Reliability , Aerospace industry , Climate , Defense industry , Elastic moduli , Electronics

Heterogeneous Integration

Machine Learning and Simulation Based Temperature Prediction on High-Performance Processors

Carlton Knox, Zihao Yuan, Ayse K. Coskun

InterPACK 2022; V001T05A001https://doi.org/10.1115/IPACK2022-96751

Abstract

View Articletitled, Machine Learning and Simulation Based Temperature Prediction on High-Performance Processors

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Topics: Machine learning , Simulation , Temperature

Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

Daeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee

InterPACK 2022; V001T05A002https://doi.org/10.1115/IPACK2022-97218

Abstract

View Articletitled, Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

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Topics: Bonding , Computation , Computer simulation , Deformation , Design , Engineering prototypes , Flow (Dynamics) , Levitation , Optimization , Physics

Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation

Chongyang Cai, Jiefeng Xu, Yangyang Lai, Junbo Yang, Huayan Wang, Suresh Ramalingam, Gamal Refai-Ahmed, Seungbae Park

InterPACK 2022; V001T05A003https://doi.org/10.1115/IPACK2022-97338

Abstract

View Articletitled, Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation

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Topics: Computer simulation , Electrodiffusion , Physics

On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)

Sukrut Prashant Phansalkar, Bongtae Han, Ehsan Akbari, Paulius Vaitiekunas

InterPACK 2022; V001T05A004https://doi.org/10.1115/IPACK2022-97719

Abstract

View Articletitled, On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)

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Topics: Filled polymers , Viscoelasticity

Multi-Scale Thermal Transport, Thermal Materials, and Energy Systems

Power Envelope Analysis for the Thermal Optimization of a Chiplet Module

Eric Ouyang, Xiao Gu, Yonghyuk Jeong, Michael Liu

InterPACK 2022; V001T07A001https://doi.org/10.1115/IPACK2022-97204

Abstract

View Articletitled, Power Envelope Analysis for the Thermal Optimization of a Chiplet Module

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Topics: Design , Heat sinks , Junctions , Optimization , Reliability , Resistors , Risk , Simulation , Temperature

Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability

Joshua Kasitz, Larry Marshall, Jr., David Huitink

InterPACK 2022; V001T07A002https://doi.org/10.1115/IPACK2022-97399

Abstract

View Articletitled, Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability

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Topics: Cooling , Heat transfer , Nanoparticles , Phase change materials , Thermal conductivity

Additively Manufactured Liquid-Cooled Heat Sink: Gyroid-Based Design, Fabrication, and Testing

Adrian Jourdan, Alexander Sarvadi, Hector R. Siller, Huseyin Bostanci

InterPACK 2022; V001T07A003https://doi.org/10.1115/IPACK2022-97476

Abstract

View Articletitled, Additively Manufactured Liquid-Cooled Heat Sink: Gyroid-Based Design, Fabrication, and Testing

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Topics: Additive manufacturing , Design , Heat sinks , Manufacturing , Testing , Topology

Photonics and Optics

High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering

Mohammad Azarifar, Ceren Cengiz, Kerem Ocaksönmez, Asim Onal, Sedat Nizamoglu, Mehmet Arik

InterPACK 2022; V001T08A001https://doi.org/10.1115/IPACK2022-97220

Abstract

View Articletitled, High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering

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Topics: Brightness (Photometry) , Diffusion (Physics) , Electromagnetic scattering , Lasers , Radiation scattering , Scattering (Physics)

Pool Boiling Heat Transfer in Dielectric Fluids and Impact of Surfaces on the Repeatability

Tolga Emir, Yakup Gokalp Yazici, Mete Budakli, Mehmet Arik

InterPACK 2022; V001T08A002https://doi.org/10.1115/IPACK2022-97266

Abstract

View Articletitled, Pool Boiling Heat Transfer in Dielectric Fluids and Impact of Surfaces on the Repeatability

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Topics: Critical heat flux , Fluids , Heat transfer , Oxidation , Pool boiling

Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling

Deogratius Kisitu, Carol Caceres, Metodi Zlatinov, Denver Schaffarzick, Alfonso Ortega

InterPACK 2022; V001T08A003https://doi.org/10.1115/IPACK2022-97400

Abstract

View Articletitled, Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling

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Topics: Boiling , Computer cooling , Cooling , Copper , Flow (Dynamics) , Heat flux , Metal foams

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick

InterPACK 2022; V001T08A004https://doi.org/10.1115/IPACK2022-97455

Abstract

View Articletitled, Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

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Topics: Cables , Construction , Copper , Cycles , Density , Elastomers , Fibers , Flat heat pipes , Flip-chip , Flip-chip devices

Power Electronics

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink

InterPACK 2022; V001T09A001https://doi.org/10.1115/IPACK2022-96635

Abstract

View Articletitled, Dual Converging Jets for Enhanced Liquid Impingement Cooling

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Topics: Additive manufacturing , Electronics , Impingement cooling , Jets , Heat transfer , Nozzles , Turbulence , Aluminum , Cooling , Fluids

Comparative Analysis of Direct and Indirect Cooling of Wide-Bandgap Power Modules and Performance Enhancement of Jet Impingement-Based Direct Substrate Cooling

Himel Barua, Emre Gurpinar, Lingxiao Xue, Burak Ozpineci

InterPACK 2022; V001T09A002https://doi.org/10.1115/IPACK2022-97172

Abstract

View Articletitled, Comparative Analysis of Direct and Indirect Cooling of Wide-Bandgap Power Modules and Performance Enhancement of Jet Impingement-Based Direct Substrate Cooling

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Topics: Cooling , Energy gap

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret

InterPACK 2022; V001T09A003https://doi.org/10.1115/IPACK2022-97283

Abstract

View Articletitled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

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Topics: Bridges (Structures) , Electronics , Energy gap , Optimization , Silicon , Design , Thermal resistance , Computational fluid dynamics , Heat exchangers , Fluids

Multiphysics Co-Optimization Design and Analysis of a Double-Side-Cooled Silicon Carbide-Based Power Module

Xuhui Feng, Gilberto Moreno, Sreekant Narumanchi, Paul Paret

InterPACK 2022; V001T09A004https://doi.org/10.1115/IPACK2022-97355

Abstract

View Articletitled, Multiphysics Co-Optimization Design and Analysis of a Double-Side-Cooled Silicon Carbide-Based Power Module

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Topics: Cooling , Design , Electronics , Finite element analysis , Optimization , Silicon

Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic

InterPACK 2022; V001T09A005https://doi.org/10.1115/IPACK2022-97412

Abstract

View Articletitled, Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics

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Topics: Chemical vapor deposition , Coatings , Cooling , Density , Electrodes , Electronics , Fluids , Ionization , Thermal resistance

Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling

Zion Clarke, Sonya Smith, Reece Whitt, David Huitink

InterPACK 2022; V001T09A006https://doi.org/10.1115/IPACK2022-97446

Abstract

View Articletitled, Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling

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Topics: Additive manufacturing , Computer simulation , Cooling , Geometry , Heat , Heat sinks , Heat transfer , Manifolds , Nozzles

Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model

Utsav Gupta, Andras Vass-Varnai

InterPACK 2022; V001T09A007https://doi.org/10.1115/IPACK2022-97669

Abstract

View Articletitled, Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model

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Topics: Control systems , Design , Electric vehicles , Power converters , Automobiles , Batteries , Electronic components , Energy management , Modeling , Motors

A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)

Abdul Basit Mirza, Xiaoqiang Xu, Asif Imran Emon, Fang Luo, Shikui Chen

InterPACK 2022; V001T09A008https://doi.org/10.1115/IPACK2022-97886

Abstract

View Articletitled, A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)

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Topics: Design , Heat sinks , Optimization

Topology Optimization of Heat Sink for 3d Integrated Power Converters

Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen

InterPACK 2022; V001T09A009https://doi.org/10.1115/IPACK2022-98066

Abstract

View Articletitled, Topology Optimization of Heat Sink for 3d Integrated Power Converters

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Topics: Heat sinks , Optimization , Power converters , Topology , Design , Convection , Cooling , Computer simulation , Density , Filtration

Naturally-Cooled Heat Sinks for Next-Generation Battery Chargers

Callum Chhokar, G. Bamorovat Abadi, Nicholas McDaniel, Chris Botting, Majid Bahrami

InterPACK 2022; V001T09A010https://doi.org/10.1115/IPACK2022-98077

Abstract

View Articletitled, Naturally-Cooled Heat Sinks for Next-Generation Battery Chargers

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Topics: Batteries , Fins , Heat sinks

Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate

Anwarul Karim, Tae Kyoung Kim, Daniel Shoemaker, Yiwen Song, Joon Seop Kwak, Sukwon Choi

InterPACK 2022; V001T09A011https://doi.org/10.1115/IPACK2022-98800

Abstract

View Articletitled, Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate

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Topics: Gallium nitride , Gates (Closures) , Heating , Reliability , Temperature , Transparency

Reliability of Electronic Packages and Systems

Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

Beihan Zhao, Aniket Ajitkumar Bharamgonda, Eric Jennings, Robert G. Utter, Michael Osterman, Michael H. Azarian, Siddhartha Das, Abhijit Dasgupta, Jason Fleischer, Edwin Quinn, Daniel Hines

InterPACK 2022; V001T10A001https://doi.org/10.1115/IPACK2022-92306

Abstract

View Articletitled, Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

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Topics: Aerosols , Drops , Electronics , Silver , Temperature , Testing , Water

Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

Golam Rakib Mazumder, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2022; V001T10A002https://doi.org/10.1115/IPACK2022-93878

Abstract

View Articletitled, Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

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Topics: Creep , Damage , Lead-free solders , Solders

Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta

InterPACK 2022; V001T10A003https://doi.org/10.1115/IPACK2022-94505

Abstract

View Articletitled, Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

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Topics: Anisotropy , Crystals , Electron backscatter diffraction , Shear (Mechanics) , Solder joints

RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study

Fenny Liu, Sean Huang, Sheng Fong Yu, Chun Yen Li, Liang-Yih Hung, Yu Po Wang

InterPACK 2022; V001T10A004https://doi.org/10.1115/IPACK2022-97175

Abstract

View Articletitled, RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study

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Topics: Hazardous substances , Manufacturing , Phthalate plasticizers , Electronic equipment , Plasticizers , Risk , Semiconductor industry , Temperature , Weight (Mass)

A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

Karthik Arun Deo, Raymond-Noel Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park

InterPACK 2022; V001T10A005https://doi.org/10.1115/IPACK2022-97253

Abstract

View Articletitled, A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

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Topics: Ball-Grid-Array packaging , Fatigue life , Solder joints , Surface mount devices

Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

Yangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park

InterPACK 2022; V001T10A006https://doi.org/10.1115/IPACK2022-97349

Abstract

View Articletitled, Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

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Topics: Ball-Grid-Array packages , Ball-Grid-Array packaging , Reliability , Thermomechanics , Cycles , Solders , Corners (Structural elements) , Bonding , Deformation , Stiffness

Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate

Rabin Bhandari, Akshay Boovanahally Lakshminarayana, Krishna Bhavana Sivaraju, Pratik Vithoba Bansode, Ephrem Kejela, Dereje Agonafer

InterPACK 2022; V001T10A007https://doi.org/10.1115/IPACK2022-97423

Abstract

View Articletitled, Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate

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Topics: Cooling , Thermomechanics

Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker

InterPACK 2022; V001T10A008https://doi.org/10.1115/IPACK2022-97427

Abstract

View Articletitled, Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure

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Topics: Delamination , Epoxy adhesives , Epoxy resins , High temperature , Modeling

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Edward Davis

InterPACK 2022; V001T10A009https://doi.org/10.1115/IPACK2022-97433

Abstract

View Articletitled, Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

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Topics: High temperature , Modeling , Reliability , Flip-chip , Solder joints , Ball-Grid-Array packaging , Electronics , Fatigue failure , Fatigue life , Materials degradation

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

InterPACK 2022; V001T10A010https://doi.org/10.1115/IPACK2022-97438

Abstract

View Articletitled, High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

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Topics: Shock (Mechanics) , Solders , Temperature , Operating temperature , Alloys , High temperature , Stress , Stress-strain curves , Testing , Aerospace industry

Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson

InterPACK 2022; V001T10A011https://doi.org/10.1115/IPACK2022-97440

Abstract

View Articletitled, Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging

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Topics: Copper , Delamination , Displacement , Fracture (Materials) , High temperature , Stress

Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading

Pradeep Lall, Padmanava Choudhury, Ken Blecker

InterPACK 2022; V001T10A012https://doi.org/10.1115/IPACK2022-97448

Abstract

View Articletitled, Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading

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Topics: Bending (Stress) , Cycles , Failure , Fatigue , Fracture (Materials) , Fracture (Process) , Stress

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

InterPACK 2022; V001T10A013https://doi.org/10.1115/IPACK2022-97449

Abstract

View Articletitled, Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

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Topics: Mechanical properties , Solders , Temperature , Alloys , Storage , Aerospace industry , Automotive industry , Constitutive equations , Finite element analysis , Low temperature materials