This paper mainly discusses DC electroplating process parameter, especially the current density, affects the electroplating result (such as copper grain, surface smooth, resistivity). A positive relationship has been found between the current density and the electrodepositing speed, copper grain diameter, core cluster as well as square resistivity. Furthermore, testing structures are designed to monitor the process on line. And an observation of fluctuation along the transection has been found which is also increased with the current density.
- Nanotechnology Institute
Investigation on the Effects of Copper Electroplating Process
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Chen, Y, Li, X, Chen, SQ, & Zhang, H. "Investigation on the Effects of Copper Electroplating Process." Proceedings of the 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. Clear Water Bay, Kowloon, Hong Kong. June 3–5, 2008. pp. 619-622. ASME. https://doi.org/10.1115/MicroNano2008-70132
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