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Proceedings Papers

Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 589-592, June 3–5, 2008

Paper No: MicroNano2008-70073

DOI: https://doi.org/10.1115/MicroNano2008-70073

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Topics: Electrodiffusion, Manufacturing, Fibers, Aluminum, Anodes, Atoms, Crystallization, Current density, Temperature

Proceedings Papers

Improvement of Printed Circuit Board Assembly Process in 2.4GHz RF Circuit Products

Mu-Chun Wang, Zhen-Ying Hsieh, Ting-Yu Yang, Chia-Hao Tu, Shuang-Yuan Chen

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 737-741, June 3–5, 2008

Paper No: MicroNano2008-70093

DOI: https://doi.org/10.1115/MicroNano2008-70093

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Topics: Circuits, Printed circuit board assemblies, Electronic components, Copper, Energy dissipation, Shapes, Temperature, Assembly lines, Circuit design, Contact resistance

Proceedings Papers

Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer

Zhibo Ma, Sen Ren, Dayong Qiao, Weizheng Yuan

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 593-596, June 3–5, 2008

Paper No: MicroNano2008-70079

DOI: https://doi.org/10.1115/MicroNano2008-70079

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Topics: Manufacturing, Pressure sensors, Resonance, Semiconductor wafers, Silicon-on-insulator, Diaphragms (Mechanical devices), Diaphragms (Structural), Pressure, Silicon, Chemical etching

Proceedings Papers

Design and Fabrication of a Micro-Knife for Minimally Invasive Surgery

Hang Guo, Hui Yang, Liming Zou

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 171-173, June 3–5, 2008

Paper No: MicroNano2008-70195

DOI: https://doi.org/10.1115/MicroNano2008-70195

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Topics: Design, Manufacturing, Surgery, Displacement, Finite element methods, Microfabrication, Oscillating frequencies, Shapes, Silicon, Vibration

Proceedings Papers

Glass-Glass Wafer Bonding for Microfluidic Devices

Nick Aitken, Tony Rogers

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 529-533, June 3–5, 2008

Paper No: MicroNano2008-70293

DOI: https://doi.org/10.1115/MicroNano2008-70293

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Topics: Bonding, Glass, Microfluidics, Semiconductor wafers, Borosilicate glasses, Cavities, Quartz, Absorption, Adhesives, Biomedicine

Proceedings Papers

Fabrication of Multilayer Tubular Nanoporous Ceramic Membranes via Gel-Casting Followed by Dip-Coating

P. Ahmadian Namini, A. A. Babaluo, M. Akhfash Ardestani, E. Jannatduost, M. Peyravi

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 697-702, June 3–5, 2008

Paper No: MicroNano2008-70256

DOI: https://doi.org/10.1115/MicroNano2008-70256

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Topics: Casting, Ceramics, Coating processes, Coatings, Manufacturing, Membranes

Proceedings Papers

Fabrication of Nanoscale Vias by Offset Patterning

Chi Ho Lau, S. W. Ricky Lee

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 615-618, June 3–5, 2008

Paper No: MicroNano2008-70131

DOI: https://doi.org/10.1115/MicroNano2008-70131

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Topics: Manufacturing, Nanoscale phenomena, Photolithography, Size reduction (Materials)

Proceedings Papers

Fabrication of Phase Reflection Sawtooth Gratings Optimized by Scalar and Vector Way by Using Diamond Cutting

ChaBum Lee, T. Kuriyagawa, TaeJun Kim, SunKyu Lee

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 703-704, June 3–5, 2008

Paper No: MicroNano2008-70266

DOI: https://doi.org/10.1115/MicroNano2008-70266

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Topics: Cutting, Diamonds, Diffraction gratings, Manufacturing, Reflection, Scalars, Diffraction, Polarization (Electricity), Polarization (Light), Polarization (Waves)

Proceedings Papers

Design and Fabrication of Uncooled MEMS Capacitive FPA for IR Imaging

Shenglin Ma, Yuliang Yi, Yaquan Tang, Xiaomei Yu

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 61-64, June 3–5, 2008

Paper No: MicroNano2008-70128

DOI: https://doi.org/10.1115/MicroNano2008-70128

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Topics: Design, Infrared imaging, Manufacturing, Microelectromechanical systems, Silicon, Etching, Optimization, Thermomechanics

Proceedings Papers

Design and Simulation of Piezoelectric Micro-Cantilever Ultrasonic Transducers for Audio Directional Loudspeakers

Teng Ma, Chenguang Cai, Limei Xu, Leon Xu, Xia Wang, Jian Ma, Chuankai Qiu

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 143-148, June 3–5, 2008

Paper No: MicroNano2008-70135

DOI: https://doi.org/10.1115/MicroNano2008-70135

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Topics: Design, Loudspeakers, Microcantilevers, Simulation, Ultrasonic transducers, Manufacturing, Microelectromechanical systems, Transducers, Cantilevers, Finite element methods

Proceedings Papers

Wafer Bonding Processes for the Manufacture of Microsystems

Tony Rogers, Nick Aitken

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 705-710, June 3–5, 2008

Paper No: MicroNano2008-70292

DOI: https://doi.org/10.1115/MicroNano2008-70292

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Topics: Bonding, Microelectromechanical systems, Semiconductor wafers, Bond strength, Glass, Manufacturing, Packaging, Temperature, Vacuum, Acoustics

Proceedings Papers

Fabrication of SiC MEMS Pressure Sensor Based on Novel Vacuum-Sealed Method

Chao Wang, Xiaobao Geng, Haixia Zhang

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 623-626, June 3–5, 2008

Paper No: MicroNano2008-70136

DOI: https://doi.org/10.1115/MicroNano2008-70136

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Topics: Manufacturing, Microelectromechanical systems, Pressure sensors, Vacuum, Plasma-enhanced chemical vapor deposition, Stiction, Mechanical properties, Micromachining, Sealing (Process), Semiconductor wafers

Proceedings Papers

Back-Side Wafer Grinding Quality Affecting Back-End Assembly Process for LCD Driver ICs

Mu-Chun Wang, Zhen-Ying Hsieh, Kuo-Shu Huang, Shuang-Yuan Chen, Heng-Sheng Huang

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 557-561, June 3–5, 2008

Paper No: MicroNano2008-70014

DOI: https://doi.org/10.1115/MicroNano2008-70014

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Topics: Grinding, Manufacturing, Semiconductor wafers, Assembly lines, Crystals, Data collection, Diluents, Reliability, Semiconductors (Materials), Shapes

Proceedings Papers

Fabrication of SiC MEMS Pressure Sensor by Anodic Bonding

Wei Tang, Zhe Chen, Dayu Tian, Haixia Zhang

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 627-630, June 3–5, 2008

Paper No: MicroNano2008-70138

DOI: https://doi.org/10.1115/MicroNano2008-70138

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Topics: Bonding, Complementary metal oxide semiconductors, Manufacturing, Microelectromechanical systems, Micromachining, Pressure sensors

Proceedings Papers

CMORE: Fast Track From Lab to Fab

Lou Hermans, Raffa Borzi

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 773-780, June 3–5, 2008

Paper No: MicroNano2008-70225

DOI: https://doi.org/10.1115/MicroNano2008-70225

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Topics: Complementary metal oxide semiconductors, Contamination, Failure, Flow (Dynamics), Manufacturing, Microelectromechanical systems, Packaging, Product development, Semiconductor wafers

Proceedings Papers

Fabrication of Superhydrophilic Surfaces by Aluminum-Induced Crystallization of Amorphous Silicon

Kenneth Kollias, Hengyu Wang, Min Zou

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 631-633, June 3–5, 2008

Paper No: MicroNano2008-70143

DOI: https://doi.org/10.1115/MicroNano2008-70143

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Topics: Aluminum, Crystallization, Manufacturing, Silicon, Water

Proceedings Papers

Fabrication of Macroporous on No-Mask Silicon Substrate for Application to Microsystems

Gyoko Nagayama, Ryuji Ando, Kei Muramatsu, Takaharu Tsuruta

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 725-726, June 3–5, 2008

Paper No: MicroNano2008-70323

DOI: https://doi.org/10.1115/MicroNano2008-70323

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Topics: Etching, Manufacturing, Micro fuel cells, Microelectromechanical systems, Porosity, Silicon

Proceedings Papers

Design of a Valveless Micropump for Medical Drug Delivery Systems

W. W. F. Leung, C. H. Cheng, K. F. Lei, C. Chao, T. H. Cheung, P. K. Yueng, P. T. Yuen

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 159-162, June 3–5, 2008

Paper No: MicroNano2008-70162

DOI: https://doi.org/10.1115/MicroNano2008-70162

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Topics: Biomedicine, Design, Drug delivery systems, Micropumps, Manufacturing, Disks, Actuators, Engineering prototypes, Pumps, Flow (Dynamics)

Proceedings Papers

Investigation of Dicing Saw Methods Impacting Back-End Assembly Process

Mu-Chun Wang, Zhen-Ying Hsieh, Kuo-Shu Huang, Shuang-Yuan Chen, Heng-Sheng Huang

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 563-567, June 3–5, 2008

Paper No: MicroNano2008-70015

DOI: https://doi.org/10.1115/MicroNano2008-70015

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Topics: Manufacturing, Cutting, Machinery, Semiconductor wafers, Lasers, Assembly lines, Blades, Diamonds, Diluents, Shapes

Proceedings Papers

Preparation of Poly(Dimethylsiloxane) Chip-Based Cartridge for Isoelectric Focusing and Whole-Channel Imaging Detection

Junjie Ou, Shuwen Wang, Carolyn L. Ren, Janusz Pawliszyn

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 223-224, June 3–5, 2008

Paper No: MicroNano2008-70303

DOI: https://doi.org/10.1115/MicroNano2008-70303

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Topics: Imaging, Plasma desorption mass spectrometry, Microfluidics, Membranes, Separation (Technology), Flow (Dynamics), Glass, Proteins, Reservoirs, Design

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NARROW

Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration

Improvement of Printed Circuit Board Assembly Process in 2.4GHz RF Circuit Products

Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer

Design and Fabrication of a Micro-Knife for Minimally Invasive Surgery

Glass-Glass Wafer Bonding for Microfluidic Devices

Fabrication of Multilayer Tubular Nanoporous Ceramic Membranes via Gel-Casting Followed by Dip-Coating

Fabrication of Nanoscale Vias by Offset Patterning

Fabrication of Phase Reflection Sawtooth Gratings Optimized by Scalar and Vector Way by Using Diamond Cutting

Design and Fabrication of Uncooled MEMS Capacitive FPA for IR Imaging

Design and Simulation of Piezoelectric Micro-Cantilever Ultrasonic Transducers for Audio Directional Loudspeakers

Wafer Bonding Processes for the Manufacture of Microsystems

Fabrication of SiC MEMS Pressure Sensor Based on Novel Vacuum-Sealed Method

Back-Side Wafer Grinding Quality Affecting Back-End Assembly Process for LCD Driver ICs

Fabrication of SiC MEMS Pressure Sensor by Anodic Bonding

CMORE: Fast Track From Lab to Fab

Fabrication of Superhydrophilic Surfaces by Aluminum-Induced Crystallization of Amorphous Silicon

Fabrication of Macroporous on No-Mask Silicon Substrate for Application to Microsystems

Design of a Valveless Micropump for Medical Drug Delivery Systems

Investigation of Dicing Saw Methods Impacting Back-End Assembly Process

Preparation of Poly(Dimethylsiloxane) Chip-Based Cartridge for Isoelectric Focusing and Whole-Channel Imaging Detection

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