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Proceedings Papers

Poly(N-Isopropylacrylamide-Co-Methacrylic Acid) Micro/Nanoparticles: Formulation, Size Distribution and Use for Cu ++ Adsorption

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 237-243, June 3–5, 2008

Paper No: MicroNano2008-70019

DOI: https://doi.org/10.1115/MicroNano2008-70019

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Topics: Nanoparticles, Particulate matter, Temperature, Ions, Particle size, Metals, Surfactants, Copolymers, Weibull distribution, Hydrogels

Proceedings Papers

Simulation and Improvement of 5GHz Power Divider on FR-4 PCB

Mu-Chun Wang, Chung-Hsin Kuo, Zhen-Ying Hsieh, Chun-Wei Huang, Shuang-Yuan Chen

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 123-128, June 3–5, 2008

Paper No: MicroNano2008-70090

DOI: https://doi.org/10.1115/MicroNano2008-70090

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Topics: Simulation, Circuits, Energy dissipation, Fibers, Metals, Printed circuit boards, Resins, Stability, Strip transmission lines, Teams

Proceedings Papers

A Combined Model and Its Verification for Femtosecond-Pulse Materials Interactions

Lan Jiang, Hai-Lung Tsai

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 609-614, June 3–5, 2008

Paper No: MicroNano2008-70127

DOI: https://doi.org/10.1115/MicroNano2008-70127

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Topics: Damage, Equilibrium (Physics), Heat, Laser materials, Metals, Modeling, Nanoscale phenomena, Plasmas (Ionized gases), Shapes, Temperature

Proceedings Papers

Study for the Interface Thermal Resistance of Metal-Dielectric Layers

Heng-Chieh Chien, Da-Jen Yao, Cheng-Ting Hsu

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 423-427, June 3–5, 2008

Paper No: MicroNano2008-70280

DOI: https://doi.org/10.1115/MicroNano2008-70280

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Topics: Metals, Thermal resistance, Adhesion, Aluminum, Fluids, Microelectromechanical systems, Nickel, Plasma-enhanced chemical vapor deposition, Platinum, Thin films

Proceedings Papers

Study of Low-Temperature Wafer Bonding With Au-Au Bonding Technique

H. Kurotaki, H. Shinohara, H. Kobayashi, J. Mizuno, S. Shoji

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 765-766, June 3–5, 2008

Paper No: MicroNano2008-70064

DOI: https://doi.org/10.1115/MicroNano2008-70064

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Topics: Bonding, Low temperature, Semiconductor wafers, Metal bonding, Diffusion bonding (Metals), Brightness (Photometry), Metals, Microelectromechanical systems, Semiconductors (Materials), Temperature

Proceedings Papers

Design of Nanocrystalline Materials for Structural Applications

Ashok Saxena, Rahul Rajgarhia, Shubhra Bansal

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 277-281, June 3–5, 2008

Paper No: MicroNano2008-70012

DOI: https://doi.org/10.1115/MicroNano2008-70012

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Topics: Design, Nanocrystals, Grain boundaries, Atoms, Atomic structure, Creep, Durability, Energetics, Fatigue, Fracture toughness

Proceedings Papers

Bubble Dynamics on Nanostructured Cu Surfaces

Chen Li, Nikhil Koratkar, G. P. Peterson

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 431-436, June 3–5, 2008

Paper No: MicroNano2008-70296

DOI: https://doi.org/10.1115/MicroNano2008-70296

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Topics: Bubbles, Dynamics (Mechanics), Boiling, Nucleation (Physics), Visualization, Data acquisition systems, Density, Fluctuations (Physics), Fluids, Heat exchangers

Proceedings Papers

Indentation Mechanics for Micro- and Nano-Layered Composites

G. Tang, Y.-L. Shen

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 289-294, June 3–5, 2008

Paper No: MicroNano2008-70038

DOI: https://doi.org/10.1115/MicroNano2008-70038

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Topics: Composite materials, Deformation, Silicon, Tension, Aluminum, Ceramics, Computer simulation, Cracking (Materials), Diamonds, Finite element methods

Proceedings Papers

Study on Deformation of a Laser Surface Textured Mechanical Seal

Xu-Dong Peng, Song-En Sheng, Ji-Yun Li, Yong-Ning Cai, Shao-Xian Bai

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 79-84, June 3–5, 2008

Paper No: MicroNano2008-70186

DOI: https://doi.org/10.1115/MicroNano2008-70186

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Topics: Deformation, Lasers, Leakage, Liquid films, Pressure, Sealing (Process), Stability, Stiffness, Ceramics, Finite element analysis

Proceedings Papers

Femtosecond Laser Pulse Train Effects on Optical Characteristics and Nonequilibrium Energy Transport in Metal Thin Films Considering Quantum Effects

Hyung Sub Sim, Seong Hyuk Lee, Seungho Park, Young Ki Choi, Joon Sik Lee

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1453-1460, January 10–13, 2007

Paper No: MNC2007-21420

DOI: https://doi.org/10.1115/MNC2007-21420

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Topics: Lasers, Metals, Thin films, Trains, Electrons, Absorption, Collisions (Physics), Phonons, Reflectance, Separation (Technology)

Proceedings Papers

The Role of Thermal Excitation of D Band Electrons in Ultrafast Laser Interaction With Noble (Cu) and Transition (Pt) Metals

Zhibin Lin, Leonid V. Zhigilei

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1199-1204, January 10–13, 2007

Paper No: MNC2007-21076

DOI: https://doi.org/10.1115/MNC2007-21076

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Topics: Electrons, Excitation, Lasers, Metals, Temperature, Heat capacity, Phonons, Density, Electron configuration, Laser materials processing

Proceedings Papers

Fundamental Research on Micro Electroforming of Metal Microstructures by Using Shielded Anode

Yong-Bin Zeng, Di Zhu, Ning-Song Qu, Yang-Yang Hu

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1217-1222, January 10–13, 2007

Paper No: MNC2007-21094

DOI: https://doi.org/10.1115/MNC2007-21094

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Topics: Anodes, Electrodeposition, Electroforming, Metals, Microfabrication

Proceedings Papers

Plasma Deposition of Nanometre Thin Coatings Displaying Super Hydrophobic and Oleophobic Properties

Stephen Coulson

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1661-1662, January 10–13, 2007

Paper No: MNC2007-21423

DOI: https://doi.org/10.1115/MNC2007-21423

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Topics: Coatings, Plasmas (Ionized gases), Assaying, Glass, Metals, Microfluidics, Optimization, Polymers, Surface energy, Thin films

Proceedings Papers

Research on Mechanism of Ultra-Precision Electrical Discharge and Mechanical Grinding for Nonconductive Engineering Ceramics

Renjie Ji, Yonghong Liu, Lili Yu, Xiaopeng Li

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1445-1447, January 10–13, 2007

Paper No: MNC2007-21393

DOI: https://doi.org/10.1115/MNC2007-21393

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Topics: Ceramics, Grinding, Grinding wheels, Diamonds, Electrodes, Electrolysis, Heat, Machinery, Metals, Microcracks

Proceedings Papers

Synthesis and Properties of Cobalt Nanowires

Jianyu Liang, Zhenhai Xia

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 667-668, January 10–13, 2007

Paper No: MNC2007-21298

DOI: https://doi.org/10.1115/MNC2007-21298

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Topics: Cobalt, Nanowires, Metals, Atomic force microscopy, Manufacturing, Computer simulation, Design, Engineers, Heat, Iron

NARROW

Poly(N-Isopropylacrylamide-Co-Methacrylic Acid) Micro/Nanoparticles: Formulation, Size Distribution and Use for Cu ++ Adsorption

Simulation and Improvement of 5GHz Power Divider on FR-4 PCB

A Combined Model and Its Verification for Femtosecond-Pulse Materials Interactions

Study for the Interface Thermal Resistance of Metal-Dielectric Layers

Study of Low-Temperature Wafer Bonding With Au-Au Bonding Technique

Design of Nanocrystalline Materials for Structural Applications

Bubble Dynamics on Nanostructured Cu Surfaces

Indentation Mechanics for Micro- and Nano-Layered Composites

Study on Deformation of a Laser Surface Textured Mechanical Seal

Femtosecond Laser Pulse Train Effects on Optical Characteristics and Nonequilibrium Energy Transport in Metal Thin Films Considering Quantum Effects

The Role of Thermal Excitation of D Band Electrons in Ultrafast Laser Interaction With Noble (Cu) and Transition (Pt) Metals

Fundamental Research on Micro Electroforming of Metal Microstructures by Using Shielded Anode

Plasma Deposition of Nanometre Thin Coatings Displaying Super Hydrophobic and Oleophobic Properties

Research on Mechanism of Ultra-Precision Electrical Discharge and Mechanical Grinding for Nonconductive Engineering Ceramics

Synthesis and Properties of Cobalt Nanowires

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