This paper presents a novel method to achieve high yield assembly of millimeter-scale thin silicon chips from an air-water interface. Surface functionalized silicon parts (1×1 mm2 with 100 μm thickness) assemble in preprogrammed hydrophilic locations on a wafer substrate with self-alignment. We optimize the process and design factors systematically using DOE (Design of Experiment) that leads to high yield (close to 100 %). This paper also presents an experimental and theoretical study of a high yield self-assembly process with programmable template. An analysis of the method is presented with an emphasis on the combined effect of substrate tilting angle and part size on fluidic assembly at an air-water interface. For 1×1, 3×3 and 5×5 mm2 parts with 100 μm thickness, the maximum substrate tilting angles are experimentally determined and the surface tension induced torques are calculated based on the developed model. The result indicates that there is a limit on the lateral size of the parts that can be assembled when we use one substrate tilting angle. Based on our analysis, we propose a novel method that is capable of assembling parts of higher lateral dimensions using parametric changes in substrate tilting angle.
- Manufacturing Engineering Division
Millimeter-Scale Thin Part Self-Assembly in the Fluidic Phase and its Sensitivity to Part Scaling
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Park, KS, Baskaran, R, & Bo¨hringer, KF. "Millimeter-Scale Thin Part Self-Assembly in the Fluidic Phase and its Sensitivity to Part Scaling." Proceedings of the ASME 2011 International Manufacturing Science and Engineering Conference. ASME 2011 International Manufacturing Science and Engineering Conference, Volume 2. Corvallis, Oregon, USA. June 13–17, 2011. pp. 471-478. ASME. https://doi.org/10.1115/MSEC2011-50070
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