The goal of this work is to forward a comprehensive framework, relating to the most recent research works carried out in the area of flexible and hybrid electronics (FHE) fabrication with the aid of aerosol jet printing (AJP) additive manufacturing process. In pursuit of this goal, the objective is to review and classify a wide range of articles, published recently, concerning various aspects of AJP-based device fabrication, such as material synthesis, process monitoring, and control.
AJP has recently emerged as the technique of choice for integration as well as fabrication of a broad spectrum of electronic components and devices, e.g., interconnects, sensors, transistors, optical waveguides, quantum dot arrays, photodetectors, and circuits. This is preeminently because of advantages engendered by AJP process. AJP not only allows for high-resolution deposition of microstructures, but also accommodates a wide renege of ink viscosity. However, AJP is intrinsically complex and prone to gradual drifts of the process output (stemming from ink chemistry and formulation). Consequently, a large number of research works in the literature has focused on in situ process characterization, real-time monitoring, and closed-loop control with the aim to make AJP a rapid, reliable, and robust additive manufacturing method for the manufacture of flexible and hybrid electronic devices. It is expected that the market for flexible electronics will be worth over $50 billion by 2020 .