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Proceedings Papers

Synthesis of Nano-Dots and Lines by Glancing Angle Deposition With Corrals

Proc. ASME. MSEC2022, Volume 1: Additive Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation; Nano/Micro/Meso Manufacturing, V001T07A006, June 27–July 1, 2022

Paper No: MSEC2022-83720

DOI: https://doi.org/10.1115/MSEC2022-83720

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Topics: Manufacturing, Nanofabrication, Nanostructures , Nucleation (Physics), Semiconductor wafers, Shades and shadows, Shapes, Vapor deposition, Vapors

Proceedings Papers

Synthesis and Fabrication of Single Walled Carbon Nanotube Microelectrode Arrays on Flexible Probes for Neurotransmitter Detection

Sei Jin Park, Anna Ivanovskaya, Allison Yorita

Paper No: MSEC2022-85273

DOI: https://doi.org/10.1115/MSEC2022-85273

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Topics: Manufacturing, Probes, Single-walled carbon nanotubes, Electrodes, Metals, Carbon, Microfabrication, Resolution (Optics), Carbon nanotubes, Catalysts

Proceedings Papers

A Novel Quality Clustering Methodology on Fab-Wide Wafer Map Images in Semiconductor Manufacturing

Yuan-Ming Hsu, Xiaodong Jia, Wenzhe Li, Jay Lee

Proc. ASME. MSEC2022, Volume 2: Manufacturing Processes; Manufacturing Systems, V002T06A022, June 27–July 1, 2022

Paper No: MSEC2022-85670

DOI: https://doi.org/10.1115/MSEC2022-85670

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Topics: Integrated circuit fabrication, Semiconductor wafers, Topology, Biomedicine, Manufacturing, Semiconductors (Materials), Visualization

Proceedings Papers

Reducing Variability in Chemical Vapor Deposition of Carbon Nanotubes Based on Gas Purification and Sample Support Redesign

Golnaz Tomaraei, Moataz Abdulhafez, Jaegeun Lee, Mostafa Bedewy

Proc. ASME. MSEC2020, Volume 1: Additive Manufacturing; Advanced Materials Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation, V001T03A020, September 3, 2020

Paper No: MSEC2020-8388

DOI: https://doi.org/10.1115/MSEC2020-8388

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Topics: Carbon nanotubes, Chemical vapor deposition, Design, Semiconductor wafers, Carbon, Density, Gas flow, Helium, Oxygen, Plumbing

Proceedings Papers

Multi-Objective Optimization of Wire Electrical Discharge Machined Ultra-Thin Silicon Wafers Using Response Surface Methodology for Solar Cell Applications

Pinal Rana, Divyanshu Bhartiya, Meinam Annebushan Singh, Deepak Marla

Proc. ASME. MSEC2020, Volume 2: Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T08A021, September 3, 2020

Paper No: MSEC2020-8489

DOI: https://doi.org/10.1115/MSEC2020-8489

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Topics: Composite materials, Electrical discharge machining, Pareto optimization, Response surface methodology, Semiconductor wafers, Solar cells, Wire

Proceedings Papers

Regional Manufacturing Cost Structures and Supply Chain Considerations for Medium Voltage Silicon Carbide Power Applications

Samantha Reese, Margaret Mann, Timothy Remo, Kelsey Horowitz

Proc. ASME. MSEC2018, Volume 2: Materials; Joint MSEC-NAMRC-Manufacturing USA, V002T07A004, June 18–22, 2018

Paper No: MSEC2018-6601

DOI: https://doi.org/10.1115/MSEC2018-6601

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Topics: Manufacturing, Silicon, Supply chains, Collaboration, Energy gap, Motor drives, Semiconductor wafers, Semiconductors (Materials)

Proceedings Papers

Investigation on Smoothing Silicon Carbide Wafer With a Combined Method of Mechanical Lapping and Photocatalysis Assisted Chemical Mechanical Polishing

Zewei Yuan, Kai Cheng, Yan He, Meng Zhang

Proc. ASME. MSEC2018, Volume 4: Processes, V004T03A002, June 18–22, 2018

Paper No: MSEC2018-6615

DOI: https://doi.org/10.1115/MSEC2018-6615

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Topics: Grinding, Polishing, Semiconductor wafers, Silicon, Surface roughness, Crystals, Electron capture, Integrated circuits, Irradiation (Radiation exposure), Optoelectronic devices

Proceedings Papers

Empirical Modeling of Material Removal Considering Tool Condition in Chemical Mechanical Planarization Process

Zhenhua Wu

Proc. ASME. MSEC2017, Volume 3: Manufacturing Equipment and Systems, V003T04A070, June 4–8, 2017

Paper No: MSEC2017-3027

DOI: https://doi.org/10.1115/MSEC2017-3027

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Topics: Artificial neural networks, Errors, Flow (Dynamics), Integrated circuit fabrication, Modeling, Polishing, Pressure, Rotation, Semiconductor wafers, Slurries

Proceedings Papers

Plasmonic Nanofocusing in Deep and Extreme Sub-Wavelength Scale for Scalable Nanolithography

Zhidong Du, Chen Chen, Liang Pan

Proc. ASME. MSEC2017, Volume 3: Manufacturing Equipment and Systems, V003T04A072, June 4–8, 2017

Paper No: MSEC2017-2680

DOI: https://doi.org/10.1115/MSEC2017-2680

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Topics: Nanolithography, Wavelength, Nanoscale phenomena, Lithography, Resolution (Optics), Air bearings, Design, Imaging, Lenses (Optics), Mass production

Proceedings Papers

In-Line Dimensional Metrology for Nanomanufacturing Systems

Tsung-Fu Yao, Andrew Duenner, Michael Cullinan

Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A076, June 27–July 1, 2016

Paper No: MSEC2016-8566

DOI: https://doi.org/10.1115/MSEC2016-8566

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Topics: Dimensional metrology, Nanomanufacturing, Inspection, Atomic force microscopy, Bending (Stress), Semiconductor wafers, Manufacturing, Nanoscale phenomena, Microelectromechanical systems, Actuators

Proceedings Papers

A Method to Manufacture Repeatible Graphene-Based NEMS Devices at the Wafer-Scale

Joon Hyong Cho, Guoao Sun, Michael Cullinan

Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A077, June 27–July 1, 2016

Paper No: MSEC2016-8567

DOI: https://doi.org/10.1115/MSEC2016-8567

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Topics: Graphene, Nanoelectromechanical devices, Semiconductor wafers, Manufacturing, Tension, Microelectromechanical systems, Actuators, Displacement, Nanomechanical resonators, Electrodes

Proceedings Papers

Micro-Machinability Studies of Single Crystal Silicon Using Diamond End-Mill

Zi Jie Choong, Dehong Huo, Patrick Degenaar, Anthony O’Neill

Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A004, June 27–July 1, 2016

Paper No: MSEC2016-8622

DOI: https://doi.org/10.1115/MSEC2016-8622

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Topics: Crystals, Diamonds, Machinability, Silicon, Machining, Cutting, Micromilling, Semiconductor wafers, Size effect, Brittleness

Proceedings Papers

Scalable Plasmonic Nanolithography: Prototype System Design and Construction

Yuan Wang, Mohamed E. Saad, Kang Ni, Yen Chi Chang, Cheng-Wei Chen, Chen Chen, Liang Pan, Tsu Chin Tsao, Adrienne S. Lavine, David B. Bogy, Xiang Zhang

Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A081, June 27–July 1, 2016

Paper No: MSEC2016-8671

DOI: https://doi.org/10.1115/MSEC2016-8671

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Topics: Construction, Design, Engineering prototypes, Nanolithography, Lithography, Metrology, Air bearings, Imaging, Mass production, Nanoscale phenomena

Proceedings Papers

Three-Dimensional Modification in Silicon With Infrared Nanosecond Laser

Xiaoming Yu, Carlos A. Trallero-Herrero, David Grojo, Shuting Lei

Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A030, June 27–July 1, 2016

Paper No: MSEC2016-8686

DOI: https://doi.org/10.1115/MSEC2016-8686

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Topics: Lasers, Silicon, Absorption, Chemical etching, Cross section (Physics), Damage, Density, Dielectric materials, Laser beams, Lenses (Optics)

Proceedings Papers

Direct Electrochemical Imprinting of Sinusoidal Linear Gratings Into Silicon

Bruno Azeredo, Keng Hsu, Placid Ferreira

Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A086, June 27–July 1, 2016

Paper No: MSEC2016-8835

DOI: https://doi.org/10.1115/MSEC2016-8835

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Topics: Diffraction gratings, Silicon, Etching, Chemical etching, Catalysts, Resolution (Optics), Electron beams, Lithography, Nanoscale phenomena, Semiconductors (Materials)

Proceedings Papers

Investigation of PZT/Si Wafer Micro Milling Using Diamond Coated Tool

Tsen-Chen Tai, Ming-Chyuan Lu, Chia-Che Wu, Yen-Cheng Chou, Yao-Yang Tsai

Proc. ASME. MSEC2014, Volume 1: Materials; Micro and Nano Technologies; Properties, Applications and Systems; Sustainable Manufacturing, V001T03A012, June 9–13, 2014

Paper No: MSEC2014-4087

DOI: https://doi.org/10.1115/MSEC2014-4087

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Topics: Diamonds, Milling, Semiconductor wafers, Cutting, Signals, Machining, Thin films, Brittleness, Interferometers, Dynamometers

Proceedings Papers

Single Point Diamond Turning of Silicon by Using Micro-Laser Assisted Machining Technique

Hossein Mohammadi, H. Bogac Poyraz, Deepak Ravindra, John A. Patten

Proc. ASME. MSEC2014, Volume 2: Processing, V002T02A057, June 9–13, 2014

Paper No: MSEC2014-4138

DOI: https://doi.org/10.1115/MSEC2014-4138

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Topics: Diamond turning, Lasers, Machining, Silicon, Cutting tools, Semiconductor wafers, Brittleness, Diamonds, Fiber lasers, Crystals

Proceedings Papers

Sub-Surface Crack Analysis for Diamond Slurry Lapping of Sapphire Wafers

Chao-Chang A. Chen, Wei-Kang Tu, Jyun-Kai Yang

Proc. ASME. MSEC2014, Volume 2: Processing, V002T02A010, June 9–13, 2014

Paper No: MSEC2014-3995

DOI: https://doi.org/10.1115/MSEC2014-3995

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Topics: Diamonds, Fracture (Materials), Grinding, Sapphire, Semiconductor wafers, Slurries, Temperature, Viscosity, Instrumentation, Polishing

Proceedings Papers

Ablation Dynamics of Silicon by Femtosecond Laser and the Role of Early Plasma

Xin Zhao, Yung C. Shin

Proc. ASME. MSEC2013, Volume 1: Processing, V001T01A076, June 10–14, 2013

Paper No: MSEC2013-1107

DOI: https://doi.org/10.1115/MSEC2013-1107

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Topics: Ablation (Vaporization technology), Dynamics (Mechanics), Lasers, Plasmas (Ionized gases), Silicon, Fluence (Radiation measurement), Absorption, Electrons, Laser ablation, Laser beams

Proceedings Papers

A Preliminary Numerical Study of the Slurry Wire Sawing Process

Chunhui Chung

Proc. ASME. MSEC2012, ASME 2012 International Manufacturing Science and Engineering Conference, 119-125, June 4–8, 2012

Paper No: MSEC2012-7289

DOI: https://doi.org/10.1115/MSEC2012-7289

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Topics: Sawing, Slurries, Wire, Brittleness, Semiconductor wafers, Stress, Computer simulation, Fracture (Materials), Sawing machines, Simulation results

NARROW

Synthesis of Nano-Dots and Lines by Glancing Angle Deposition With Corrals

Synthesis and Fabrication of Single Walled Carbon Nanotube Microelectrode Arrays on Flexible Probes for Neurotransmitter Detection

A Novel Quality Clustering Methodology on Fab-Wide Wafer Map Images in Semiconductor Manufacturing

Reducing Variability in Chemical Vapor Deposition of Carbon Nanotubes Based on Gas Purification and Sample Support Redesign

Multi-Objective Optimization of Wire Electrical Discharge Machined Ultra-Thin Silicon Wafers Using Response Surface Methodology for Solar Cell Applications

Regional Manufacturing Cost Structures and Supply Chain Considerations for Medium Voltage Silicon Carbide Power Applications

Investigation on Smoothing Silicon Carbide Wafer With a Combined Method of Mechanical Lapping and Photocatalysis Assisted Chemical Mechanical Polishing

Empirical Modeling of Material Removal Considering Tool Condition in Chemical Mechanical Planarization Process

Plasmonic Nanofocusing in Deep and Extreme Sub-Wavelength Scale for Scalable Nanolithography

In-Line Dimensional Metrology for Nanomanufacturing Systems

A Method to Manufacture Repeatible Graphene-Based NEMS Devices at the Wafer-Scale

Micro-Machinability Studies of Single Crystal Silicon Using Diamond End-Mill

Scalable Plasmonic Nanolithography: Prototype System Design and Construction

Three-Dimensional Modification in Silicon With Infrared Nanosecond Laser

Direct Electrochemical Imprinting of Sinusoidal Linear Gratings Into Silicon

Investigation of PZT/Si Wafer Micro Milling Using Diamond Coated Tool

Single Point Diamond Turning of Silicon by Using Micro-Laser Assisted Machining Technique

Sub-Surface Crack Analysis for Diamond Slurry Lapping of Sapphire Wafers

Ablation Dynamics of Silicon by Femtosecond Laser and the Role of Early Plasma

A Preliminary Numerical Study of the Slurry Wire Sawing Process

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