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Proc. ASME. MSEC2019, Volume 2: Processes; Materials, V002T03A021, June 10–14, 2019
Paper No: MSEC2019-2707
... mode machining is used to describe the behavior of the brittle silicon workpiece. This study aims to investigate the effects of operating temperature and number of multiple impact hits on material removal mechanism of VANILA process. The impact speed of the loose abrasives is kept constant at 200 m/s...
Proc. ASME. MSEC2011, ASME 2011 International Manufacturing Science and Engineering Conference, Volume 1, 127-136, June 13–17, 2011
Paper No: MSEC2011-50055
... removal, and (2) the removed volume by each diamond grain in one vibration cycle can be related to its indentation volume in the workpiece through a mechanistic parameter. Experiments with UVAG of silicon are conducted to determine the mechanistic parameter for silicon. With the developed model...
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 1, 309-316, October 12–15, 2010
Paper No: MSEC2010-34324
... 22 04 2011 Solar panels have been developed to convert the solar energy to electricity. Since most solar panels are silicon based, they inherit the mechanical properties of silicon, such as brittleness and hardness. These properties might lead to cracking in workpieces and low tool...
Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 2, 685-692, October 4–7, 2009
Paper No: MSEC2009-84096
... ELECTRONICS VIA PHOTONICS TO OTHER ADVANCED MATERIALS Wolfgang Skorupa FZD Dresden-Rossendorf Dresden, Germany Wolfgang Anwand FHR Anlagenbau GmbH Ottendorf-Okrilla, Germany Thoralf Gebel DTF Dresden Thin Film Technol. Dresden, Germany KEYWORDS millisecond processing, flash lamp annealing, silicon, germanium...