In this paper, in order to solve the problem of intensified heat dissipation in high power electronic devices, a fast transient and intensified heat dissipation technology was put forward by comparing many heat transfer modes based on the analytical study on the existing technologies about heat dissipation at high heat flux density and about fast heat transport. This technology combined spray cooling technology with fast endothermic chemical reaction processes; we summarized the characteristics of media applicable to an environment with transient high heat flux density by comparing various parameters of many sprayed media in the spray cooling process. According to the energy balance of endothermic chemical reactions of relevant media, we determined the media (mainly carbon dioxide hydrate) applicable to the fast transient and intensified heat dissipation technology and presented the conditions for the chemical reactions. We analyzed the methods controlling the instantaneous chemical reaction rate and proposed the structural characteristics of the chemical reactor so as to ensure that the time for heat removal will be control to around 0.01 second. Thus, the problem of fast transient heat dissipation in high power electronic devices, etc. would be radically solved.
Fast Transient and Intensified Heat Dissipation Applicable to High Heat Flux Density
- Views Icon Views
- Share Icon Share
- Search Site
Li, J, Fan, S, Yao, Z, Li, J, & Wei, X. "Fast Transient and Intensified Heat Dissipation Applicable to High Heat Flux Density." Proceedings of the ASME 2011 Power Conference collocated with JSME ICOPE 2011. ASME 2011 Power Conference, Volume 2. Denver, Colorado, USA. July 12–14, 2011. pp. 563-568. ASME. https://doi.org/10.1115/POWER2011-55408
Download citation file: