In the island-interconnect design, the device islands connected by interconnects are mounted on a soft elastomeric substrate. The out-of-plane motion of interconnects accommodates the deformation applied to the system, enabling stretchable feather in electronics. The areal coverage, however, decreases due to the presence of interconnects. This problem is difficult to address for many important applications where high areal coverage is desired. By minimizing the interfacial stress between the device islands and substrate, a structured substrate introduces surface relief in the substrate and this design offers a desired level of stretchability with a relatively large areal coverage. Theoretical and numerical investigations give the strain levels in both the substrate and interconnect, providing design guidance on the optimization of the geometric and material parameters in the experiment.
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June 2014
Technical Briefs
Mechanics of Solar Module on Structured Substrates
Zhuangjian Liu,
Zhuangjian Liu
Institute of High Performance Computing
,1 Fusionopolis Way
,No. 16-16 Connexis
,Singapore 138632
, Singapore
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Huanyu Cheng,
Huanyu Cheng
Department of Civil and Environmental Engineering,
Northwestern University
,Evanston, IL 60208
Department of Mechanical Engineering,
Northwestern University
,Evanston, IL 60208
Center for Engineering and Health,
Northwestern University
,Evanston, IL 60208
Skin Disease Research Center,
Northwestern University
,Evanston, IL 60208
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Jian Wu
Jian Wu
1
AML,
Department of Engineering Mechanics,
Department of Engineering Mechanics,
Tsinghua University
,Beijing 100084
, China
Center for Mechanics and Materials,
e-mail: wujian@tsinghua.edu.cn
Tsinghua University
,Beijing 100084
, China
e-mail: wujian@tsinghua.edu.cn
1Corresponding author.
Search for other works by this author on:
Zhuangjian Liu
Institute of High Performance Computing
,1 Fusionopolis Way
,No. 16-16 Connexis
,Singapore 138632
, Singapore
Huanyu Cheng
Department of Civil and Environmental Engineering,
Northwestern University
,Evanston, IL 60208
Department of Mechanical Engineering,
Northwestern University
,Evanston, IL 60208
Center for Engineering and Health,
Northwestern University
,Evanston, IL 60208
Skin Disease Research Center,
Northwestern University
,Evanston, IL 60208
Jian Wu
AML,
Department of Engineering Mechanics,
Department of Engineering Mechanics,
Tsinghua University
,Beijing 100084
, China
Center for Mechanics and Materials,
e-mail: wujian@tsinghua.edu.cn
Tsinghua University
,Beijing 100084
, China
e-mail: wujian@tsinghua.edu.cn
1Corresponding author.
Manuscript received December 18, 2013; final manuscript received January 9, 2014; accepted manuscript posted January 10, 2014; published online February 4, 2014. Editor: Yonggang Huang.
J. Appl. Mech. Jun 2014, 81(6): 064502 (3 pages)
Published Online: February 4, 2014
Article history
Received:
December 18, 2013
Revision Received:
January 9, 2014
Accepted:
January 10, 2014
Citation
Liu, Z., Cheng, H., and Wu, J. (February 4, 2014). "Mechanics of Solar Module on Structured Substrates." ASME. J. Appl. Mech. June 2014; 81(6): 064502. https://doi.org/10.1115/1.4026472
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